المؤلفون: Hu, C.-K., Gignac, L. G., Ohm, J., Breslin, C. M., Huang, E., Bonilla, G., Liniger, E., Rosenberg, R., Choi, S., Simon, A. H.

المصدر: AIP Conference Proceedings ; ISSN 0094-243X

الإتاحة: https://doi.org/10.1063/1.4881341Test

المؤلفون: Inoue, N., Ito, F., Shobha, H., Gates, S., Ryan, E. T., Virwani, K., Klvmko, N., Madan, A., Tai, L., Adams, E., Cohen, S., Liniger, E., Hu, C-K, Mignot, Y., Grill, A., Spooner, T.

المصدر: 2013 IEEE International Interconnect Technology Conference - IITC

الإتاحة: https://doi.org/10.1109/iitc.2013.6615590Test
http://xplorestaging.ieee.org/ielx7/6596165/6615543/06615590.pdf?arnumber=6615590Test

المؤلفون: Inoue, N., Tagami, M., Ito, F., Yamamoto, H., Kawahara, J., Soda, E., Shobha, H., Gates, S., Cohen, S., Liniger, E., Madan, A., Protzman, J., Ryan, E. T., Ryan, V., Ueki, M., Hayashi, Y., Spooner, T.

المصدر: 2012 IEEE International Interconnect Technology Conference

الإتاحة: https://doi.org/10.1109/iitc.2012.6251641Test
http://xplorestaging.ieee.org/ielx5/6242772/6251555/06251641.pdf?arnumber=6251641Test

المؤلفون: Atkin, J. M., Shaw, T. M., Liniger, E., Laibowitz, R. B., Heinz, T. F.

المصدر: 2012 IEEE International Reliability Physics Symposium (IRPS)

الإتاحة: https://doi.org/10.1109/irps.2012.6241875Test
http://xplorestaging.ieee.org/ielx5/6235191/6241755/06241875.pdf?arnumber=6241875Test

المؤلفون: Lin, Qinghuang, Nelson, A., Bozano, L., Brock, P., Cohen, S., Davis, B., Kwong, R., Liniger, E., Neumayer, D., Rathore, J. S., Shobha, H., Sooriyakumaran, R., Purushothaman, S., Miller, R., Allen, R., Spooner, T., Wisnieff, R.

المساهمون: Allen, Robert D., Somervell, Mark H.

المصدر: SPIE Proceedings ; Advances in Resist Materials and Processing Technology XXVIII ; ISSN 0277-786X

الإتاحة: https://doi.org/10.1117/12.881571Test

المؤلفون: Lin, Qinghuang, Chen, S. T., Nelson, A., Brock, P., Cohen, S., Davis, B., Fuller, N., Kaplan, R., Kwong, R., Liniger, E., Neumayer, D., Patel, J., Shobha, H., Sooriyakumaran, R., Purushothaman, S., Spooner, T., Miller, R., Allen, R., Wisnieff, R.

المساهمون: Allen, Robert D.

المصدر: SPIE Proceedings ; Advances in Resist Materials and Processing Technology XXVII ; ISSN 0277-786X

الإتاحة: https://doi.org/10.1117/12.851225Test

المؤلفون: Nogami, T., Bolom, T., Simon, A., Kim, B-Y., Hu, C-K., Tsumura, K., Madan, A., Baumann, F., Wang, Y., Flaitz, P., Parks, C., DeHaven, P., Davis, R., Zaitz, M., Lawrence, B. St., Murphy, R., Tai, L., Molis, S., Rhee, S-H., Usui, T., Cabral, C., Maniscalco, J., Clevenger, L., Li, B., Christiansen, C., Chen, F., Lee, T., Schmatz, J., Shobha, H., Ito, F., Ryan, T., Nguyen, S., Canaperi, D., Arnold, J., Choi, S., Cohen, S., Liniger, E., Chen, H-C., Chen, S-T., Vo, T., Kelly, J., Straten, O., Penny, C., Bonilla, G., Kozlowski, P., Spooner, T., Edelstein, D.

المصدر: 2010 International Electron Devices Meeting

الإتاحة: https://doi.org/10.1109/iedm.2010.5703471Test
http://xplorestaging.ieee.org/ielx5/5692854/5703218/05703471.pdf?arnumber=5703471Test

المؤلفون: Lin, Qinghuang, Chen, S.T., Nelson, A., Brock, P., Cohen, S., Davis, B., Fuller, N., Gambino, J., Kaplan, R., Kwong, R., Liniger, E., Neumayer, D., Patel, J., Shobha, H., Sooriyakumaran, R., Purushothaman, S., Spooner, T., Miller, R., Allen, R., Wisnieff, R.

المصدر: 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology

الإتاحة: https://doi.org/10.1109/icsict.2010.5667506Test
http://xplorestaging.ieee.org/ielx5/5658734/5667273/05667506.pdf?arnumber=5667506Test

المؤلفون: Lloyd, J.R., Liu, X-.H, Bonilla, G., Shaw, T.M., Liniger, E., Lisi, A.

المصدر: 2009 IEEE International Reliability Physics Symposium

الإتاحة: https://doi.org/10.1109/irps.2009.5173317Test
http://xplorestaging.ieee.org/ielx5/5164157/5173200/05173317.pdf?arnumber=5173317Test

المؤلفون: Yang, C.-C., Edelstein, D., Chanda, K., Wang, P., Hu, C.-K., Liniger, E., Cohen, S., Lloyd, J.R., Li, B., McFeely, F., Wisnieff, R., Ishizaka, T., Cerio, F., Suzuki, K., Rullan, J., Selsley, A., Jomen, M.

المصدر: 2009 IEEE International Interconnect Technology Conference

الإتاحة: https://doi.org/10.1109/iitc.2009.5090402Test
http://xplorestaging.ieee.org/ielx5/5069981/5090321/05090402.pdf?arnumber=5090402Test