المؤلفون: Roschelle, Micah, Rabbani, Rozhan, Gweon, Surin, Kumar, Rohan, Vercruysse, Alec, Cho, Nam Woo, Spitzer, Matthew H., Niknejad, Ali M., Stojanovic, Vladimir M., Anwar, Mekhail

مصطلحات موضوعية: Physics - Medical Physics, Electrical Engineering and Systems Science - Systems and Control

الوصف: Real-time monitoring of dynamic biological processes in the body is critical to understanding disease progression and treatment response. This data, for instance, can help address the lower than 50% response rates to cancer immunotherapy. However, current clinical imaging modalities lack the molecular contrast, resolution, and chronic usability for rapid and accurate response assessments. Here, we present a fully wireless image sensor featuring a 2.5$\times$5 mm$^2$ CMOS integrated circuit for multicolor fluorescence imaging deep in tissue. The sensor operates wirelessly via ultrasound (US) at 5 cm depth in oil, harvesting energy with 221 mW/cm$^{2}$ incident US power density (31% of FDA limits) and backscattering data at 13 kbps with a bit error rate <$10^{-6}$. In-situ fluorescence excitation is provided by micro-laser diodes controlled with a programmable on-chip driver. An optical frontend combining a multi-bandpass interference filter and a fiber optic plate provides >6 OD excitation blocking and enables three-color imaging for detecting multiple cell types. A 36$\times$40-pixel array captures images with <125 $\mu$m resolution. We demonstrate wireless, dual-color fluorescence imaging of both effector and suppressor immune cells in ex vivo mouse tumor samples with and without immunotherapy. These results show promise for providing rapid insight into therapeutic response and resistance, guiding personalized medicine.
Comment: *equally contributing authors

الوصول الحر: http://arxiv.org/abs/2406.18881Test

المؤلفون: Rabbani, Rozhan, Roschelle, Micah, Gweon, Surin, Kumar, Rohan, Vercruysse, Alec, Cho, Nam Woo, Spitzer, Matthew H., Niknejad, Ali M., Stojanovic, Vladimir M., Anwar, Mekhail

المصدر: 2024 IEEE International Solid-State Circuits Conference (ISSCC)

الإتاحة: https://doi.org/10.1109/isscc49657.2024.10454380Test
http://xplorestaging.ieee.org/ielx7/10454133/10454267/10454380.pdf?arnumber=10454380Test

المؤلفون: Gweon, Surin, Kang, Sanghoon, Kim, Kwantae, Yoo, Hoi-Jun

الإتاحة: https://doi.org/10.5167/uzh-231297Test
https://www.zora.uzh.ch/id/eprint/231297Test

المؤلفون: Gweon, Surin, Kang, Sanghoon, Han, Donghyeon, Lee, Kyoung-Rog, Kim, Kwantae, Yoo, Hoi-Jun

المصدر: 2021 IEEE Asian Solid-State Circuits Conference (A-SSCC)

الإتاحة: https://doi.org/10.1109/a-sscc53895.2021.9634746Test
http://xplorestaging.ieee.org/ielx7/9634699/9634177/09634746.pdf?arnumber=9634746Test

المؤلفون: Lee, Jaehyuk, Gweon, Surin, Lee, Kwonjoon, Um, Soyeon, Lee, Kyoung-Rog, Kim, Kwantae, Lee, Jihee, Yoo, Hoi-Jun

المصدر: 2020 IEEE Custom Integrated Circuits Conference (CICC)

الإتاحة: https://doi.org/10.1109/cicc48029.2020.9075950Test
http://xplorestaging.ieee.org/ielx7/9060424/9075871/09075950.pdf?arnumber=9075950Test

المؤلفون: Lee, Jaehyuk, Gweon, Surin, Lee, Kwonjoon, Um, Soyeon, Lee, Kyoung-Rog, Yoo, Hoi-Jun

المساهمون: Institute for Information and Communications Technology Promotion (IITP) Grant, Korea Government (MSIP)

المصدر: IEEE Journal of Solid-State Circuits ; volume 56, issue 3, page 887-898 ; ISSN 0018-9200 1558-173X

الإتاحة: https://doi.org/10.1109/jssc.2020.3032723Test
http://xplorestaging.ieee.org/ielx7/4/9361453/09250452.pdf?arnumber=9250452Test

المؤلفون: Gweon, Surin, Lee, Jaehyuk, Kim, Kwantae, Yoo, Hoi-Jun

المصدر: 2019 IEEE International Symposium on Circuits and Systems (ISCAS)

الإتاحة: https://doi.org/10.1109/iscas.2019.8702435Test
http://xplorestaging.ieee.org/ielx7/8682239/8702066/08702435.pdf?arnumber=8702435Test

المؤلفون: Kim, Kwantae, Kim, Ji-Hoon, Gweon, Surin, Lee, Jiwon, Kim, Minseo, Lee, Yongsu, Kim, Soyeon, Yoo, Hoi-Jun

المصدر: 2019 IEEE International Solid- State Circuits Conference - (ISSCC)

الإتاحة: https://doi.org/10.1109/isscc.2019.8662466Test
http://xplorestaging.ieee.org/ielx7/8656625/8662285/08662466.pdf?arnumber=8662466Test

المؤلفون: Lee, Yongsu, Kim, Kwantae, Lee, Jiwon, Lee, Kyoung-Rog, Gweon, Surin, Kim, Minseo, Yoo, Hoi-Jun

المصدر: 2019 IEEE International Solid- State Circuits Conference - (ISSCC)

الإتاحة: https://doi.org/10.1109/isscc.2019.8662504Test
http://xplorestaging.ieee.org/ielx7/8656625/8662285/08662504.pdf?arnumber=8662504Test

المؤلفون: Kim, Kwantae, Kim, Ji-Hoon, Gweon, Surin, Kim, Minseo, Yoo, Hoi-Jun

المساهمون: Institute for Information & communications Technology Promotion(IITP) grant, Korea government, On-device Instant Learning Complex Intelligence Processor Architecture and ADAS Design for Self-driving Platform)

المصدر: IEEE Journal of Solid-State Circuits ; volume 55, issue 8, page 2161-2173 ; ISSN 0018-9200 1558-173X

مصطلحات موضوعية: Electrical and Electronic Engineering

الإتاحة: https://doi.org/10.1109/jssc.2020.2991511Test
http://xplorestaging.ieee.org/ielx7/4/9146394/09094195.pdf?arnumber=9094195Test