المؤلفون: K. Saarinen, A. Cumini, Laura Frisk

المصدر: IEEE Transactions on Components and Packaging Technologies. 33:138-147

مصطلحات موضوعية: Stress (mechanics), Interconnection, Reliability (semiconductor), Materials science, Adhesive bonding, Soldering, Electronic engineering, Temperature cycling, Adhesive, Electrical and Electronic Engineering, Composite material, Flip chip, Electronic, Optical and Magnetic Materials

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::9b146831248557d7c454343dd1723680Test
https://doi.org/10.1109/tcapt.2009.2026570Test

المؤلفون: K. Saarinen, K. Simola, P. Aaltonen

المصدر: Aaltonen, P, Saarinen, K & Simola, K 1993, ' The correlation of IGSCC propagation with the power plant transient history ', International Journal of Pressure Vessels and Piping, vol. 55, no. 1, pp. 149-162 . https://doi.org/10.1016/0308-0161Test(93)90053-V

مصطلحات موضوعية: Materials science, Power station, Mechanical Engineering, Nuclear engineering, Metallurgy, Fracture mechanics, Intergranular corrosion, law.invention, Stress (mechanics), Cracking, Mechanics of Materials, law, Nuclear power plant, General Materials Science, Transient (oscillation), Stress corrosion cracking

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f662ae3e4008e192081aeb923d2494b1Test
https://doi.org/10.1016/0308-0161Test(93)90053-v

المؤلفون: K. Saarinen, P. Heino

المصدر: PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

مصطلحات موضوعية: Stress (mechanics), Materials science, Moisture, Soldering, Adhesive, Composite material, Failure mode and effects analysis, Electrical conductor, Finite element method, Flip chip

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::bd035b983c88f433d56e1c345ff6f3d4Test
https://doi.org/10.1109/portable-polytronic.2008.4681297Test