التفاصيل البيبلوغرافية
| العنوان: |
Role of surfactants in construction of porous copper film by electrodeposition approach. |
| المؤلفون: |
Wang, N, Hu, W C, Lu, Y H, Deng, Y F, Wan, X B, Zhang, Y W, Du, K, Zhang, L |
| المصدر: |
Transactions of the Institute of Metal Finishing; Sep2011, Vol. 89 Issue 5, p261-267, 7p |
| مصطلحات موضوعية: |
SURFACE active agents, COPPER, THIN films, ELECTROFORMING, HYDROGEN, BROMIDES, SODIUM sulfate, X-ray diffraction |
| مستخلص: |
Porous copper films have been successfully electrodeposited using a hydrogen bubble template. The cationic surfactant cetyl trimethylammonium bromide, the anionic surfactant sodium dodecyl sulphate, the non-ionic surfactant alkylphenol polyoxyethylene and combined surfactants were used as additives to the electroplating baths. The purpose was to evaluate the effects of these surfactants on the microstructure and morphology of porous electrodeposited copper films. X-ray diffraction results show an obvious difference in the crystallinities of porous copper films derived from baths containing different surfactants. Field emission scanning electron microscopy micrographs reveal that both the size and morphology of the pore walls acutely depend on the type of surfactant. [ABSTRACT FROM AUTHOR] |
|
Copyright of Transactions of the Institute of Metal Finishing is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| قاعدة البيانات: |
Supplemental Index |
