دورية أكاديمية

Investigation of Detection Limits of Resistive Contact Plugs in Electron Beam Inspection Using Modeling and Simulation.

التفاصيل البيبلوغرافية
العنوان: Investigation of Detection Limits of Resistive Contact Plugs in Electron Beam Inspection Using Modeling and Simulation.
المؤلفون: De, Indranil1, Shadman, Khashayar2, Zapalac, Geordie2
المصدر: IEEE Transactions on Semiconductor Manufacturing. Nov2007, Vol. 20 Issue 4, p556-565. 100p. 3 Black and White Photographs, 5 Diagrams, 7 Graphs.
مصطلحات موضوعية: *SEMICONDUCTOR industry, *MONTE Carlo method, *ESTIMATION theory, ELECTRON beams, SEMICONDUCTOR wafers, SEMICONDUCTORS
مستخلص: Electron beam inspection has been commonly used in the semiconductor fabrication process to inspect wafers for defective metal or polysilicon plugs, plugs that fail to make an electrical contact to the underlying circuitry. Recently, there has been interest in using electron beams to inspect plugs that are not necessarily electrically floating but have a high resistive path to ground. This paper addresses the reliability of such an inspection by examining the minimum resistance value that is detectable for a given column condition and gives guidelines for optimal inspection conditions for finding such a defective plug. The investigation is done using a transient simulation in a general purpose 3-D electron beam simulator that uses Monte Carlo simulations to trace the path of an ensemble of charged particles in an electrostatic field and couples with a general purpose Poisson solver that is also used to update the electrostatic fields from evolving charge profiles. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Semiconductor Manufacturing is the property of IEEE and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
قاعدة البيانات: Business Source Index
الوصف
تدمد:08946507
DOI:10.1109/TSM.2007.907629