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1دورية أكاديمية
المؤلفون: Chen, W. S.1, Shei, S. C.2, Chang, S. J.1 changsj@mail.ncku.edu.tw, Su, Y. K.1, Lai, W. C.3, Kuo, C. H.4, Lin, Y. C.1, Chang, C. S.2, Ko, T. K.1, Hsu, Y. P.1, Shen, C. F.1
المصدر: IEEE Transactions on Electron Devices. Jan2006, Vol. 53 Issue 1, p32-37. 6p.
مصطلحات موضوعية: LIGHT emitting diodes, FLIP chip technology, NITRIDES, ANNEALING of metals, REFLECTANCE, OHMIC contacts, SEMICONDUCTORS
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2دورية أكاديمية
المؤلفون: Shen, C. F., Chang, S. J., Ko, T. K., Shei, S. C., Lai, W. C., Chang, C. S., Chen, W. S., Huang, S. P., Ku, Y. W., Horng, R. H.
المصدر: IET Optoelectronics (Institution of Engineering & Technology); Feb2007, Vol. 1 Issue 1, p27-30, 4p, 1 Diagram, 5 Graphs
مصطلحات موضوعية: FLIP chip technology, LIGHT emitting diodes, NITRIDES, OPTICAL communications, METAL organic chemical vapor deposition, ELECTRONIC packaging, MICROELECTRONICS
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3دورية أكاديمية
المؤلفون: Ko, T. K., Chang, S. J., Su, Y. K., Chiou, Y. Z., Chang, C. S., Shei, S. C., Sheu, J. K., Lai, W. C., Lin, Y. C., Chen, W. S., Shen, C. F.
المصدر: IEEE Transactions on Advanced Packaging; Aug2006, Vol. 29 Issue 3, p483-487, 5p, 9 Black and White Photographs, 3 Diagrams, 2 Graphs
مصطلحات موضوعية: FLIP chip technology, ELECTRONIC packaging, PHOTODIODES, SEMICONDUCTOR diodes, SEMICONDUCTORS, ELECTRIC conductivity
