دورية أكاديمية
The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing
| العنوان: | The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing |
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| المؤلفون: | Chen, Guang, Li, Jiqiang, Kuang, Xinwen, Wu, Yaofeng, Wu, Fengshun |
| المصدر: | Soldering & Surface Mount Technology, 2019, Vol. 31, Issue 4, pp. 261-270. |
| الوصول الحر: | http://www.emeraldinsight.com/doi/10.1108/SSMT-11-2018-0043Test |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 09540911 |
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| DOI: | 10.1108/SSMT-11-2018-0043 |