المؤلفون: Uzunlar, Erdal, Wilson, Zachary, Kohl, Paul A.

المصدر: Journal of The Electrochemical Society; 2013, Vol. 160 Issue 12, pD3237-D3246, 10p

مصطلحات موضوعية: ELECTROLESS deposition, ELECTROLESS plating, COPPER research, CATALYSTS, SURFACES (Technology), LAMINATED materials

المؤلفون: Hyo-Chol Koo, Saha, Rajarshi, Kohl, Paul A.

المصدر: Journal of The Electrochemical Society; 2012, Vol. 159 Issue 5, pD319-D322, 4p

مصطلحات موضوعية: ELECTROLESS plating, ELECTRIC properties, COPPER, DISULFIDES, ELECTROPHORETIC deposition, SOLID state chemistry

المؤلفون: Koo, Hyo-Chol, Lightsey, Charles, Kohl, Paul A.

المصدر: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2012, Vol. 2 Issue 1, p79-84, 6p

مصطلحات موضوعية: INTEGRATED circuits, ELECTROLESS plating, COPPER, SUBSTRATES (Materials science), SOLDER & soldering, TEMPERATURE effect, MICROFABRICATION

المؤلفون: Koo, Hyo-Chol, Saha, Rajarshi, Kohl, Paul A.

المصدر: Journal of The Electrochemical Society; 2011, Vol. 158 Issue 12, pD698-D703, 6p

مصطلحات موضوعية: ELECTROLESS plating, COPPER, ELECTROPLATING, SURFACE active agents, SPUTTERING (Physics), PHOTOLITHOGRAPHY, TITANIUM, CHROMIUM

المؤلفون: Kim, Hyea¹, Kohl, Paul A. kohl@gatech.edu

المصدر: Journal of Power Sources. Apr2010, Vol. 195 Issue 8, p2224-2229. 6p.

مصطلحات موضوعية: *FUEL cell electrodes, *SILICA, *GELATION, *METHANOL as fuel, *NANOPARTICLES, *CATALYSTS, *ELECTROLESS plating, *OXIDATION

المؤلفون: Osborn, Tyler, Galiba, Nefertari, Kohl, Paul A.

المصدر: Journal of The Electrochemical Society; 2009, Vol. 156 Issue 7, pD226-D230, 5p

مصطلحات موضوعية: ELECTROLESS plating, COPPER plating, COPPER, SUBSTRATES (Materials science), ANNEALING of metals, POLYETHYLENE glycol

المؤلفون: Osborn, Tyler, He, Ate, Galiba, Nefertari, Kohl, Paul A.

المصدر: Journal of The Electrochemical Society; 2008, Vol. 155 Issue 4, pD308-D313, 6p, 14 Black and White Photographs, 3 Diagrams, 1 Chart

مصطلحات موضوعية: INTEGRATED circuit interconnections, COPPER plating, ELECTROLESS plating, ANNEALING of metals, LOW temperatures, MICROSTRUCTURE

المؤلفون: Osborn, Tyler tyler.osborn@chbe.gatech.edu, Hunter Lightsey, C.¹, Kohl, Paul A.¹

المصدر: Microelectronic Engineering. Mar2009, Vol. 86 Issue 3, p379-386. 8p.

مصطلحات موضوعية: *FLIP chip technology, *SURFACE coatings, *ELECTROLESS plating, *ANNEALING of metals, *COPPER, *DIELECTRICS, *CHEMICAL structure, *THERMOMECHANICAL properties of metals

المؤلفون: Lightsey, Charles Hunter

المساهمون: Kohl, Paul A., Hess, Dennis W., Peter Hesketh, School of Chemical and Biomolecular Engineering, College of Engineering, Chemical Engineering

مصطلحات موضوعية: Bonding, Flip-chip, Pillar, Electroless deposition, Copper, Flip chip technology, Microelectronic packaging, Microelectronics, Electroless plating

وصف الملف: application/pdf

العلاقة: http://hdl.handle.net/1853/34729Test

الإتاحة: http://hdl.handle.net/1853/34729Test

المؤلفون: Hayden, Harley T.

المساهمون: Kohl, Paul A., Bidstrup Allen, Sue Ann, Hess, Dennis, Nair, Sankar, Qu, Jianmin, School of Chemical and Biomolecular Engineering, College of Engineering, Chemical and Biomolecular Engineering

مصطلحات موضوعية: Electroless copper, Dielectric, Plasma, Adhesion, Electroless plating, Copper plating, Chemical bonds

وصف الملف: application/pdf

العلاقة: http://hdl.handle.net/1853/22615Test

الإتاحة: http://hdl.handle.net/1853/22615Test