دورية أكاديمية

Interaction mechanism between various collectors and nonmetal components of waste printed circuit boards.

التفاصيل البيبلوغرافية
العنوان: Interaction mechanism between various collectors and nonmetal components of waste printed circuit boards.
المؤلفون: Yao, Yake1,2 (AUTHOR), He, Jingfeng1,2 (AUTHOR) jfhe@cumt.edu.cn, Yang, Bin1,2 (AUTHOR)
المصدر: Advanced Powder Technology. Jun2024, Vol. 35 Issue 6, pN.PAG-N.PAG. 1p.
مصطلحات موضوعية: *PRINTED circuits, *NONMETALS, *X-ray photoelectron spectroscopy, *DIESEL fuels, *POLYCHLORINATED biphenyls, *PHYSISORPTION, *DYNAMIC simulation
مستخلص: [Display omitted] • Adsorption of the collectors was investigated by instrument detection. • Molecular dynamic simulation was employed to explain the adsorption effect. • Simulation results are consistent with previous experimental results. • Interaction energy between collectors and nonmetal surface was calculated. Reverse flotation has been remarkably a feasible access for the separation of metal and nonmetal components of waste printed circuit boards (PCBs). In order to deeply explore flotation mechanism of waste PCBs, instrument detection and molecular dynamic simulation were used to investigate the interaction mechanism between collectors and nonmetal components. The results of zeta potential measurement and X-ray photoelectron spectroscopy (XPS) analysis demonstrated that diesel oil (DO), composite collector (CC) and laurylamine (LAM) have the physical adsorption effect on nonmetal sample surface. Results of molecular dynamic simulation with ultra-fine accuracy indicated that DO has the lay-flat adsorption and largest interaction energy value of −167.67 kcal/mol, and more negative interaction energy means stronger adsorption between DO and nonmetal surface. The molecular dynamic simulation results agree with experimental results. Therefore, this work presents a new approach to reveal the adsorption mechanism of collectors on nonmetal component surface at the molecular level in relation to reverse flotation of waste PCBs. [ABSTRACT FROM AUTHOR]
قاعدة البيانات: Academic Search Index
الوصف
تدمد:09218831
DOI:10.1016/j.apt.2024.104486