دورية أكاديمية
Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
| العنوان: | Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers |
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| المؤلفون: | Pan Yi, Kui Xiao, Kangkang Ding, Chaofang Dong, Xiaogang Li |
| المصدر: | Materials, Vol 10, Iss 2, p 137 (2017) |
| بيانات النشر: | MDPI AG |
| سنة النشر: | 2017 |
| المجموعة: | Directory of Open Access Journals: DOAJ Articles |
| مصطلحات موضوعية: | electrochemical migration, copper dendrites, PCB-Cu, PCB-ENIG, thin electrolyte layer, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85 |
| الوصف: | The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| تدمد: | 1996-1944 |
| العلاقة: | http://www.mdpi.com/1996-1944/10/2/137Test; https://doaj.org/toc/1996-1944Test; https://doaj.org/article/6c6dd197e1dd44b3964b3cfa5f4d7dcdTest |
| DOI: | 10.3390/ma10020137 |
| الإتاحة: | https://doi.org/10.3390/ma10020137Test https://doaj.org/article/6c6dd197e1dd44b3964b3cfa5f4d7dcdTest |
| رقم الانضمام: | edsbas.9193B28C |
| قاعدة البيانات: | BASE |
Full Text Finder | تدمد: | 19961944 |
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| DOI: | 10.3390/ma10020137 |