المؤلفون: Wang, Robin C.J., Chang-Liao, K.S., Wang, T.K., Lee, C.C., Lin, J.H., Oates, A.S., Lee, S.C., Wu, Kenneth

المساهمون: 王天戈

مصطلحات موضوعية: copper, stress-induced void, migration, interconnect, finite element analysis

الوقت: 22

وصف الملف: 106 bytes; text/html

العلاقة: Thin Solid Films, Elsevier, Volume 516, Issues 2-4, 3 December 2007, Pages 449-453; http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47404Test

الإتاحة: http://nthur.lib.nthu.edu.tw/dspace/handle/987654321/47404Test

المؤلفون: Fang, J.S., Lin, J.H., Chen, B.Y., Chen, G.S., Chin, T.S.

المصدر: Journal of Electronic Materials; Jan2012, Vol. 41 Issue 1, p138-143, 6p, 2 Black and White Photographs, 3 Graphs

مصطلحات موضوعية: THIN films, RUTHENIUM, CARBON, COPPER, MAGNETRONS, SPUTTERING (Physics), INTEGRATED circuit interconnections, AMORPHOUS substances

المؤلفون: Ho, S.C.¹, Chern Lin, J.H.¹, Ju, C.P. cpju@mail.ncku.edu.tw

المصدر: Carbon. Mar2005, Vol. 43 Issue 3, p491-502. 12p.

مصطلحات موضوعية: *CARBONIZATION, *COPPER, *PHENOLIC resins, *FRICTION materials, *TEMPERATURE