المؤلفون: K. Saarinen, A. Cumini, Laura Frisk

المصدر: IEEE Transactions on Components and Packaging Technologies. 33:138-147

مصطلحات موضوعية: Stress (mechanics), Interconnection, Reliability (semiconductor), Materials science, Adhesive bonding, Soldering, Electronic engineering, Temperature cycling, Adhesive, Electrical and Electronic Engineering, Composite material, Flip chip, Electronic, Optical and Magnetic Materials

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::9b146831248557d7c454343dd1723680Test
https://doi.org/10.1109/tcapt.2009.2026570Test

المؤلفون: K. Saarinen, P. Heino

المصدر: PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.

مصطلحات موضوعية: Stress (mechanics), Materials science, Moisture, Soldering, Adhesive, Composite material, Failure mode and effects analysis, Electrical conductor, Finite element method, Flip chip

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::bd035b983c88f433d56e1c345ff6f3d4Test
https://doi.org/10.1109/portable-polytronic.2008.4681297Test