Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
| العنوان: | Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers |
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| المؤلفون: | Chaofang Dong, Kangkang Ding, Pan Yi, Kui Xiao, Xiaogang Li |
| المصدر: | Materials Materials; Volume 10; Issue 2; Pages: 137 Materials, Vol 10, Iss 2, p 137 (2017) |
| سنة النشر: | 2017 |
| مصطلحات موضوعية: | Materials science, copper dendrites, chemistry.chemical_element, 02 engineering and technology, Electrolyte, 01 natural sciences, lcsh:Technology, Article, law.invention, Electroless nickel, PCB-Cu, law, 0103 physical sciences, General Materials Science, electrochemical migration, Composite material, lcsh:Microscopy, lcsh:QC120-168.85, 010302 applied physics, lcsh:QH201-278.5, lcsh:T, PCB-ENIG, Metallurgy, thin electrolyte layer, Electroless nickel immersion gold, food and beverages, 021001 nanoscience & nanotechnology, Copper, Cathode, Anode, Electrochemical migration, chemistry, lcsh:TA1-2040, lcsh:Descriptive and experimental mechanics, lcsh:Electrical engineering. Electronics. Nuclear engineering, 0210 nano-technology, lcsh:Engineering (General). Civil engineering (General), Short circuit, lcsh:TK1-9971 |
| الوصف: | The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. |
| وصف الملف: | application/pdf |
| تدمد: | 1996-1944 |
| الوصول الحر: | https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5bfcc4980f0b7e10020912eca5e0a46Test https://pubmed.ncbi.nlm.nih.gov/28772497Test |
| حقوق: | OPEN |
| رقم الانضمام: | edsair.doi.dedup.....b5bfcc4980f0b7e10020912eca5e0a46 |
| قاعدة البيانات: | OpenAIRE |
| تدمد: | 19961944 |
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