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1
المؤلفون: Michael L. Rieger
المصدر: Design for Manufacturability through Design-Process Integration V.
مصطلحات موضوعية: Volume (thermodynamics), Mechanics, Geology, Front (military)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::01836004d0e45f90c3321a0ead4e2ff8Test
https://doi.org/10.1117/12.897032Test -
2
المؤلفون: Joerg Thiele, Michael L. Rieger
المصدر: Design for Manufacturability through Design-Process Integration IV.
مصطلحات موضوعية: Materials science, Volume (thermodynamics), Mechanics, Front (military)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::27a5709115ee151bd6277a4a4cefa654Test
https://doi.org/10.1117/12.863953Test -
3
المؤلفون: Vivek K. Singh, Michael L. Rieger
المصدر: Design for Manufacturability through Design-Process Integration III.
مصطلحات موضوعية: Volume (thermodynamics), Mechanics, Geology, Front (military)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::d1b8aa99330f2294632722d48da102c5Test
https://doi.org/10.1117/12.828060Test -
4
المؤلفون: Vivek K. Singh, Michael L. Rieger
المصدر: Design for Manufacturability through Design-Process Integration II.
مصطلحات موضوعية: Optics, business.industry, business, Geology, Front (military)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::262c8951df86a14d1eab48b6f25afbf8Test
https://doi.org/10.1117/12.797490Test -
5
المؤلفون: Philippe Hurat, Denis L. Goinard, Michel L. Cote, Michael L. Rieger, Alexander Miloslavsky
المصدر: Design and Process Integration for Microelectronic Manufacturing III.
مصطلحات موضوعية: Engineering, Resolution enhancement technologies, business.industry, Yield (finance), Design flow, Design for manufacturability, Reliability engineering, Cost reduction, Design intent, Hardware_INTEGRATEDCIRCUITS, Node (circuits), business, Lithography, Simulation
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::c1b54a4ece789440da9064f51ab340e0Test
https://doi.org/10.1117/12.600086Test -
6
المصدر: Design and Process Integration for Microelectronic Manufacturing III.
مصطلحات موضوعية: Engineering, Engineering drawing, Optical proximity correction, business.industry, Optical engineering, Metric (mathematics), Process (computing), Range (statistics), Point (geometry), Process window, business, Algorithm, Design for manufacturability
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::cfff8697fbad653104aacde332f1d0bcTest
https://doi.org/10.1117/12.600180Test -
7
المؤلفون: Lawrence S. Melvin, Michael L. Rieger, James P. Shiely
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Engineering, Bar (music), business.industry, Circuit design, Process (computing), Integrated circuit layout, Optical proximity correction, Feature (computer vision), Electronic engineering, Computer vision, Artificial intelligence, business, Lithography, Aerial image
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::53e33e631b67551d27fd6069e65e2500Test
https://doi.org/10.1117/12.569179Test -
8
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Engineering, Fabrication, business.industry, Bandwidth (signal processing), Hardware_INTEGRATEDCIRCUITS, Electronic engineering, Wafer, Hardware_PERFORMANCEANDRELIABILITY, Lithography process, business, Lithography
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::189a34fc234b3d06613afa11158e6650Test
https://doi.org/10.1117/12.568550Test -
9
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Engineering, Current (mathematics), Bridging (networking), business.industry, One-dimensional space, Process (computing), Interpretation (model theory), Optical proximity correction, Feature (computer vision), Feature based, Computer vision, Artificial intelligence, business, Algorithm
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::9b8d15cc9decdebfa4ea1d4d4e595985Test
https://doi.org/10.1117/12.557742Test -
10
المصدر: SPIE Proceedings.
مصطلحات موضوعية: Physics, Engineering drawing, Single model, Optics, Process modeling, Offset (computer science), Resist, business.industry, Process window, Process simulation, business, Lithography, Aerial image
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::51b2b82aa0c9dd1c277cbd5015a15cdcTest
https://doi.org/10.1117/12.544258Test
