التفاصيل البيبلوغرافية
| العنوان: |
SoL-Compliant Wafer-Level Package Technologies. |
| المؤلفون: |
Bakir, Muhannad, Mulé, Anthony, Thacker, Hiren, Kohl, Paul, Martin, Kevin, Meindl, James |
| المصدر: |
Semiconductor International; Apr2002, Vol. 25 Issue 4, p61, 3p, 1 Color Photograph, 1 Black and White Photograph, 2 Diagrams |
| مصطلحات موضوعية: |
INTEGRATED circuits, SEMICONDUCTOR industrial equipment industry |
| مستخلص: |
Focuses on the integration of integrated circuits into digital system. Components of gigascale integration; Development of cost effective interconnect solutions for semiconductor industry; Planarity of testing boards. |
| قاعدة البيانات: |
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