دورية أكاديمية
Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions.
| العنوان: | Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions. |
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| المؤلفون: | Yong, Yingqiong, Mai Thanh Nguyen, Tsukamoto, iroki, Matsubara, Masaki, Liao, Ying-Chih, Yonezawa, Tetsu |
| بيانات النشر: | Nature Publishing Group |
| المجموعة: | Hokkaido University Collection of Scholarly and Academic Papers (HUSCAP) / 北海道大学学術成果コレクション |
| الوقت: | 560 |
| الوصف: | Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 x 10(-6) Omega center dot m) at a temperature as low as 100 degrees C was achieved without using any reductive gas. |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| العلاقة: | http://hdl.handle.net/2115/65227Test; Scientific reports, 7: 45150; http://dx.doi.org/10.1038/srep45150Test |
| DOI: | 10.1038/srep45150 |
| الإتاحة: | https://doi.org/10.1038/srep45150Test http://hdl.handle.net/2115/65227Test |
| حقوق: | https://creativecommons.org/licenses/by/4.0Test/ |
| رقم الانضمام: | edsbas.530D3122 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1038/srep45150 |
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