دورية أكاديمية
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
| العنوان: | Co-Package Technology Platform for Low-Power and Low-Cost Data Centers |
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| المؤلفون: | Papatryfonos, Konstantinos, Selviah, David R., Maman, Avi, Hasharoni, Kobi, Brimont, Antoine Christian Jacques, Zanzi, Andrea, Kraft, Jochen, Sidorov, Victor, Seifried, Marc, Baumgartner, Yannick, Horst, Folkert, Offrein, Bert Jan, Lawniczuk, Katarzyna, Broeke, Ronald G., Terzenidis, Nikos, Sanchis Kilders, Pablo |
| المساهمون: | Universitat Politècnica de València. Instituto Universitario de Tecnología Nanofotónica - Institut Universitari de Tecnologia Nanofotònica, Universitat Politècnica de València. Departamento de Comunicaciones - Departament de Comunicacions, COMISION DE LAS COMUNIDADES EUROPEA |
| بيانات النشر: | MDPI AG |
| سنة النشر: | 2021 |
| المجموعة: | Universitat Politécnica de Valencia: RiuNet / Politechnical University of Valencia |
| مصطلحات موضوعية: | Silicon photonics, 3D device integration, Hybrid integration, Optical interconnects, Quantum well hybrid laser, Quantum dots, WDM, CWDM, Slow-light modulators, Co-package, TEORIA DE LA SEÑAL Y COMUNICACIONES |
| الوصف: | [EN] We report recent advances in photonic-electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges. ; The L3MATRIX project is co-funded by the Horizon 2020 Framework Programme of the European Union with Grant Agreement Nr. 688544. L3MATRIX project is an initiative of the Photonics Public Private Partnership. ; Papatryfonos, K.; Selviah, DR.; Maman, A.; Hasharoni, K.; Brimont, ACJ.; Zanzi, A.; Kraft, J. (2021). Co-Package Technology Platform for Low-Power and Low-Cost Data Centers. Applied Sciences. 11(13):1-24. https://doi.org/10.3390/app11136098Test ; 1 ; 24 ; 11 ; 13 |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| تدمد: | 2076-3417 |
| العلاقة: | Applied Sciences; info:eu-repo/grantAgreement/EC/H2020/688544/EU; https://doi.org/10.3390/app11136098Test; http://hdl.handle.net/10251/182723Test; urn:eissn:2076-3417 |
| DOI: | 10.3390/app11136098 |
| الإتاحة: | https://doi.org/10.3390/app11136098Test http://hdl.handle.net/10251/182723Test |
| حقوق: | http://creativecommons.org/licenses/by/4.0Test/ ; info:eu-repo/semantics/openAccess |
| رقم الانضمام: | edsbas.96624E79 |
| قاعدة البيانات: | BASE |
Full Text Finder | تدمد: | 20763417 |
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| DOI: | 10.3390/app11136098 |