دورية أكاديمية
3D FEM models for numerical simulation of induction sealing of packaging material
| العنوان: | 3D FEM models for numerical simulation of induction sealing of packaging material |
|---|---|
| المؤلفون: | Babini, A., Borsari, R., Fontanini, A., Dughiero, F., Forzan, M. |
| المصدر: | COMPEL -The international journal for computation and mathematics in electrical and electronic engineering, 2003, Vol. 22, Issue 1, pp. 170-180. |
| الوصول الحر: | http://www.emeraldinsight.com/doi/10.1108/03321640310452268Test |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 03321649 |
|---|---|
| DOI: | 10.1108/03321640310452268 |