نتائج البحث - "INTEGRATED optics"

1

Miniaturization of 2 × 4 90-Degree Hybrid Optical Couplers

المؤلفون: Alessio Miranda, Weiming Yao, Jos J. G. M. van der Tol, Kevin A. Williams

المساهمون: Photonic Integration

المصدر: IEEE Journal of Quantum Electronics, 59(3):0600909. Institute of Electrical and Electronics Engineers

مصطلحات موضوعية: optical strip waveguide components, Photodetectors, Integrated optics, Phase detection, optical signal detection, Optical coupling, Condensed Matter Physics, Indium phosphide, Optical waveguide components, Atomic and Molecular Physics, and Optics, III-V semiconductor materials, Waveguide components, indium compounds, Photonics, Multimode waveguides, Performance evaluation, Local oscillators, Electrical and Electronic Engineering, Couplers

وصف الملف: application/pdf

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b27f4c30fa34f0ad2f47983028fc94cTest
https://doi.org/10.1109/jqe.2022.3227306Test

2

SPICE-Compatible Equivalent Circuit Models for Accurate Time-Domain Simulations of Passive Photonic Integrated Circuits

المؤلفون: Yinghao Ye, Thijs Ullrick, Wim Bogaerts, Tom Dhaene, Domenico Spina

المصدر: JOURNAL OF LIGHTWAVE TECHNOLOGY

مصطلحات موضوعية: Mathematical models, Technology and Engineering, Photonics, SPICE-compatible equivalent circuits, time-domain simulations, Integrated circuit modeling, Equivalent circuits, Integrated optics, Computational modeling, Complex Vector Fitting, photonic integrated circuits, Atomic and Molecular Physics, and Optics, Optical scattering

وصف الملف: application/pdf

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09dd0301d118224b7cca72ea8b82990eTest
https://doi.org/10.1109/jlt.2022.3206818Test

3

PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

المصدر: IEEE Journal of Selected Topics in Quantum Electronics, 28 (3), Art.Nr. 8300311
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Bundalo, I L, Morrissey, P E, Annoni, A, Baets, R, Blache, F, Breyne, L, Carroll, L, Collins, S, Dietrich, P I, Halmo, L, Jorge, F, Karppinen, M, Kaunisto, M, Kelly, B, Vankerrebrouck, J, Koos, C, Lahti, M, Lambrecht, J, Tienforti, M, Lee, J S, Missinne, J, Ossieur, P, Pessina, R, Sterken, T, Van Steenberge, G, Vannucci, A, Vannucchi, A, Verplancke, R, Wuytens, P, Xu, Y, Zoldak, M & O'brien, P 2022, ' PIXAPP Photonics Packaging Pilot Line development of a silicon photonic optical transceiver with pluggable fiber connectivity ', IEEE Journal of Selected Topics in Quantum Electronics, vol. 28, no. 3, 8300311 . https://doi.org/10.1109/JSTQE.2022.3158891Test

مصطلحات موضوعية: Technology and Engineering, Intensity modulation, photonics, Optical device fabrication, communication systems, Optical transmitters, Chip scale packaging, Demodulation, telecommunications, Atomic and Molecular Physics, high-speed electronics, TECHNOLOGY, Optical fibers, Electrical and Electronic Engineering, electronic packaging thermal management, Engineering & allied operations, Modulation, silicon photonics, PIC, Optics, chip scale packaging, Integrated optics, High-speed integrated circuits, demodulation, PIC packaging, Atomic and Molecular Physics, and Optics, high-speed integrated circuits, modulation, Electrooptic modulators, High-speed optical techniques, Packaging, electronics packaging, ddc:620, intensity modulation, semiconductor device packaging