المؤلفون: Nguyen, Binh T., Trinh, Minh H., Phan, Tan V., Nguyen, Hien D.

المصدر: 2017 Seventh International Conference on Information Science and Technology (ICIST)

الإتاحة: https://doi.org/10.1109/icist.2017.7926765Test
http://xplorestagingTest.ieee.org/ielx7/7919505/7926488/07926765.pdf?arnumber=7926765

المؤلفون: Tan V. Phan, Minh H. Trinh, Binh T. Nguyen, Hien D. Nguyen

المصدر: 2017 Seventh International Conference on Information Science and Technology (ICIST).

مصطلحات موضوعية: business.industry, Computer science, Emotion detection, Feature extraction, 02 engineering and technology, Support vector machine, 03 medical and health sciences, 0302 clinical medicine, Face (geometry), Kernel (statistics), 0202 electrical engineering, electronic engineering, information engineering, 020201 artificial intelligence & image processing, Computer vision, Emotion recognition, Artificial intelligence, business, 030217 neurology & neurosurgery

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::cc1e5fc822a85b375ecbbf756847c11dTest
https://doi.org/10.1109/icist.2017.7926765Test

المؤلفون: Lazar, M. L., Lurski, A., Ghafurian, S., Chen, L., Uko, L., Tan, V., Li, K.

المصدر: 2015 41st Annual Northeast Biomedical Engineering Conference (NEBEC)

الإتاحة: https://doi.org/10.1109/nebec.2015.7117109Test
http://xplorestagingTest.ieee.org/ielx7/7114134/7117035/07117109.pdf?arnumber=7117109

المؤلفون: Rodrigues, M., Bolcskei, H., Draper, S., Eldar, Y., Tan, V.

المصدر: IEEE Journal of Selected Topics in Signal Processing; Oct2018, Vol. 12 Issue 5, p821-824, 4p

المؤلفون: Cao, Tri-Tan V., Palmer, James, Berry, Paul E.

المصدر: 2010 IEEE Radar Conference

الإتاحة: https://doi.org/10.1109/radar.2010.5494633Test
http://xplorestagingTest.ieee.org/ielx5/5482534/5494381/05494633.pdf?arnumber=5494633

المؤلفون: Tan, V. B. C.¹ mpetanbc@nus.edu.sg, Tong, M. X.¹, Kian Meng Lim¹, Chwee Teck Lim¹

المصدر: IEEE Transactions on Components & Packaging Technologies. Sep2005, Vol. 28 Issue 3, p555-560. 6p.

مصطلحات موضوعية: *ELECTRONIC packaging, *FINITE element method, *INTEGRATED circuits, *MICROELECTRONICS, BALL grid array technology, ELECTRONICS

المؤلفون: Raphael, G., Berka, C., Kintz, N., Tan, V., Behneman, A., Johnson, R.

المصدر: 2010 IEEE International Conference on Technologies for Homeland Security (HST); 2010, p536-542, 7p

المؤلفون: Tan, V., Anandkumar, A., Willsky, A.S.

المصدر: 2009 47th Annual Allerton Conference on Communication, Control & Computing (Allerton); 2009, p684-691, 8p