-
1مؤتمر
المؤلفون: May, D., Wunderle, B., Cirulis, I., Braun, S., Zschenderlein, U., Heilmann, J., Pantou, R., Schacht, R., Rzepka, R., Ras, M. Abo, Kurth, S., Kuhn, H.
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
الإتاحة: https://doi.org/10.1109/eurosime60745.2024.10491500Test
http://xplorestagingTest.ieee.org/ielx7/10491281/10491408/10491500.pdf?arnumber=10491500 -
2مؤتمر
المؤلفون: Panahandeh, S., May, D., Wargulski, D.R., Boschman, E., Schacht, R., Ras, M. Abo, Wunderle, B.
المصدر: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
الإتاحة: https://doi.org/10.1109/eurosime52062.2021.9410883Test
http://xplorestagingTest.ieee.org/ielx7/9410808/9410806/09410883.pdf?arnumber=9410883 -
3مؤتمر
المؤلفون: Wargulski, D. R., May, D., Petrick, J., Schacht, R., Wunderle, B., Abo Ras, M.
المصدر: 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic49743.2020.9420531Test
http://xplorestagingTest.ieee.org/ielx7/9420452/9420488/09420531.pdf?arnumber=9420531 -
4مؤتمر
المؤلفون: Wunderle, B., May, D., Heilmann, J., Arnold, J., Hirscheider, J., Li, Y., Bauer, J., Schacht, R., Ras, M. Abo
المصدر: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
الإتاحة: https://doi.org/10.1109/eurosime.2019.8724540Test
http://xplorestagingTest.ieee.org/ielx7/8718745/8724505/08724540.pdf?arnumber=8724540 -
5مؤتمر
المؤلفون: Wunderle, B., Heilmann, J., May, D., Arnold, J., Hirscheider, J., Bauer, J., Schacht, R., Vogel, J., Ras, M. Abo
المصدر: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic.2017.8233806Test
http://xplorestagingTest.ieee.org/ielx7/8206642/8233782/08233806.pdf?arnumber=8233806 -
6مؤتمر
المؤلفون: Schacht, R., Rzepka, S.
المصدر: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic.2017.8233822Test
http://xplorestagingTest.ieee.org/ielx7/8206642/8233782/08233822.pdf?arnumber=8233822 -
7مؤتمر
المؤلفون: Ras, M. Abo, May, D., Schacht, R., Bast, M., Eisele, R., Michel, B., Winkler, T., Rzepka, R., Wunderle, B.
المصدر: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic.2015.7389630Test
http://xplorestagingTest.ieee.org/ielx7/7365562/7389593/07389630.pdf?arnumber=7389630 -
8مؤتمر
المؤلفون: Schacht, R., Punch, J., Merten, E., Rzepka, S., Michel, B.
المصدر: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic.2015.7389603Test
http://xplorestagingTest.ieee.org/ielx7/7365562/7389593/07389603.pdf?arnumber=7389603 -
9مؤتمر
المؤلفون: May, D., Fritzsche, S., Cardoso, A., Schacht, R., Wunderle, B.
المصدر: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
الإتاحة: https://doi.org/10.1109/therminic.2015.7389622Test
http://xplorestagingTest.ieee.org/ielx7/7365562/7389593/07389622.pdf?arnumber=7389622 -
10مؤتمر
المؤلفون: May, D., Wunderle, B., Schacht, R., Michel, B.
المصدر: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
الإتاحة: https://doi.org/10.1109/eurosime.2013.6529959Test
http://xplorestagingTest.ieee.org/ielx7/6522572/6529888/06529959.pdf?arnumber=6529959
