المؤلفون: Samuel Parent, Frederic Vachon, Valerie Gauthier, Steve Lamoureux, Alexandre Paquette, Jacob Deschamps, Tommy Rossignol, Nicolas Roy, Philippe Arsenault, Henri Dautet, Serge A. Charlebois, Jean-Francois Pratte

المصدر: IEEE Journal of the Electron Devices Society, Vol 12, Pp 127-137 (2024)

مصطلحات موضوعية: Active probe card, photon-to-digital converter, process control monitoring, silicon photomultiplier, single-photon avalanche diode, wafer-level testing, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

العلاقة: https://ieeexploreTest.ieee.org/document/10414786/; https://doaj.org/toc/2168-6734Test

الوصول الحر: https://doaj.org/article/227b16494c96405e875220c6e2c1c4e0Test

المؤلفون: Lovett, Samuel, Paquette, Tyler, DeBoon, Brayden, Rajan, Sreeraman, Rossa, Carlos

المصدر: 2023 IEEE International Conference on Systems, Man, and Cybernetics (SMC)

الإتاحة: https://doi.org/10.1109/smc53992.2023.10394614Test
http://xplorestagingTest.ieee.org/ielx7/10391856/10393862/10394614.pdf?arnumber=10394614

المؤلفون: Moss, Benjamin R., Poulton, Christopher V., Byrd, Matthew J., Russo, Peter, Shatrovoy, Oleg, Paquette, David, Reardon, Andrew, Watts, Michael R.

المساهمون: ABB

المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

الإتاحة: https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185161Test
http://xplorestagingTest.ieee.org/ielx7/10185199/10185158/10185161.pdf?arnumber=10185161

المؤلفون: Parent, Samuel, Vachon, Frederic, Gauthier, Valerie, Paquette, Alexandre, Deschamps, Jacob, Rossignol, Tommy, Arsenault, Philippe, Paulin, Caroline, Lemay, Joel, Roy, Nicolas, Cote, Maxime, Dupont, Denis, Martel, Stephane, Dautet, Henri, Charlebois, Serge A., Pratte, Jean-Francois

المصدر: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)

الإتاحة: https://doi.org/10.1109/icmts50340.2022.9898180Test
http://xplorestagingTest.ieee.org/ielx7/9898143/9898103/09898180.pdf?arnumber=9898180

المؤلفون: Kim, Kyowon, Ke, Ming, Greenhouse, Matthew A., Kutyrev, Alexander S., Fettig, Rainer, McCandliss, Stephan R., Kotecki, Carl A., Brekosky, Regis P., Hu, Gang, Paquette, Beth M., Miller, Timothy M., Wang, Frederick H., Costen, Nicholas P., Rodriguez, Samelys, Kluengpho, Vorachai, Ray, Knute A., Aguayo, Eduardo J., Simms, Kenneth M., Chang, Meng-Ping

المساهمون: NASA

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)

الإتاحة: https://doi.org/10.1109/mems51670.2022.9699595Test
http://xplorestagingTest.ieee.org/ielx7/9698823/9699435/09699595.pdf?arnumber=9699595

المؤلفون: Samuel Parent, Frederic Vachon, Valerie Gauthier, Alexandre Paquette, Jacob Deschamps, Tommy Rossignol, Philippe Arsenault, Caroline Paulin, Joel Lemay, Nicolas Roy, Maxime Cote, Denis Dupont, Stephane Martel, Henri Dautet, Serge A. Charlebois, Jean-Francois Pratte

المصدر: 2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS).

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::a2ffe8e65c01ca78e33e2eb5a0e34c51Test
https://doi.org/10.1109/icmts50340.2022.9898180Test

المؤلفون: Kyowon Kim, Ming Ke, Matthew A. Greenhouse, Alexander S. Kutyrev, Rainer Fettig, Stephan R. McCandliss, Carl A. Kotecki, Regis P. Brekosky, Gang Hu, Beth M. Paquette, Timothy M. Miller, Frederick H. Wang, Nicholas P. Costen, Samelys Rodriguez, Vorachai Kluengpho, Knute A. Ray, Eduardo J. Aguayo, Kenneth M. Simms, Meng-Ping Chang

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS).

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::4967ca453dfccf21020b1f452742792aTest
https://doi.org/10.1109/mems51670.2022.9699595Test

المؤلفون: Michael Paquette, Brian Marquis, Rachel Bainbridge, Joe Chapman

المصدر: 2021 IEEE Physical Assurance and Inspection of Electronics (PAINE).

الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::841cc4ba2a61f1c1eacc1f2b8ef3a794Test
https://doi.org/10.1109/paine54418.2021.9707696Test

المؤلفون: Paquette, Michael, Marquis, Brian, Bainbridge, Rachel, Chapman, Joe

المصدر: 2021 IEEE Physical Assurance and Inspection of Electronics (PAINE)

الإتاحة: https://doi.org/10.1109/paine54418.2021.9707696Test
http://xplorestagingTest.ieee.org/ielx7/9707693/9707694/09707696.pdf?arnumber=9707696

المؤلفون: Ajanohoun, Jordy, Paquette, Eric, Vazquez, Carlos

المصدر: 2021 IEEE International Conference on Image Processing (ICIP)

الإتاحة: https://doi.org/10.1109/icip42928.2021.9506718Test
http://xplorestagingTest.ieee.org/ielx7/9506008/9506009/09506718.pdf?arnumber=9506718