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المؤلفون: Kazutaka Hayashi, Yoichiro Sato, Nobutaka Kidera
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Waveguide (electromagnetism), Materials science, Computer simulation, business.industry, Transmission loss, 020206 networking & telecommunications, 02 engineering and technology, Substrate (electronics), Dielectric, Condensed Matter::Disordered Systems and Neural Networks, Condensed Matter::Soft Condensed Matter, Band-pass filter, Extremely high frequency, 0202 electrical engineering, electronic engineering, information engineering, Optoelectronics, business
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::5783482c0112f35252661c353963bb58Test
https://doi.org/10.1109/ectc.2019.00113Test -
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المؤلفون: Shuhei Nomura, Kazutaka Hayashi
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Materials science, Thermal shrinkage, Process (computing), Fan-out, Fine pitch, Thermal stability, Composite material, Temperature measurement, Thermal expansion
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::164b18c223e945d58d6a980e96ec4127Test
https://doi.org/10.1109/ectc.2018.00150Test -
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المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Silicon, chemistry.chemical_element, 02 engineering and technology, Substrate (electronics), 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, Thermal expansion, 0104 chemical sciences, Ion, Reliability (semiconductor), chemistry, Anodic bonding, Electrode, Composite material, 0210 nano-technology, Wafer-level packaging
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::f1b949794656e84aef29f62d4df9dbd5Test
https://doi.org/10.1109/ectc.2017.157Test -
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المؤلفون: Kazutaka Hayashi
المصدر: 2017 International Conference on Electronics Packaging (ICEP).
مصطلحات موضوعية: Materials science, Flatness (systems theory), medicine, Stiffness, Fan-out, Optical transparency, Heat resistance, Wafer, Composite material, medicine.symptom, Thermal expansion
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::fbbc5a15060794679866a6f5091178e9Test
https://doi.org/10.23919/icep.2017.7939430Test