Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology
| العنوان: | Reliability Study of WLP for SAW Filter with Through Film Vias Using Laser Drilling technology |
|---|---|
| المؤلفون: | Zuohuan Chen, Jin Zhao, Jiqin Zhang, Long Zhang, Daquan Yu |
| المصدر: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). |
| بيانات النشر: | IEEE, 2022. |
| سنة النشر: | 2022 |
| الوصول الحر: | https://explore.openaire.eu/search/publication?articleId=doi_________::148d8a59796c0f48cd27ef09fdd7a604Test https://doi.org/10.1109/icept56209.2022.9873207Test |
| حقوق: | CLOSED |
| رقم الانضمام: | edsair.doi...........148d8a59796c0f48cd27ef09fdd7a604 |
| قاعدة البيانات: | OpenAIRE |
| الوصف غير متاح. |