المؤلفون: De Pestel, F., Moens, P., Hakim, H., De Vleeschouwer, H., Reynders, K., Colpaert, T., Colson, P., Coppens, P., Boonen, S., Bolognesi, D., Tack, M.

المصدر: ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs, 2003. Proceedings.

الإتاحة: https://doi.org/10.1109/ispsd.2003.1225259Test
http://xplorestagingTest.ieee.org/ielx5/8680/27504/01225259.pdf?arnumber=1225259

المؤلفون: De Pestel, F., Coppens, P., De Vleeschouwer, H., Colson, P., Boonen, S., Colpaert, T., Moens, P., Bolognesi, D., Coudenys, G., Tack, M.

المصدر: Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

الإتاحة: https://doi.org/10.1109/essderc.2003.1256843Test
http://xplorestagingTest.ieee.org/ielx5/8890/28111/01256843.pdf?arnumber=1256843

المؤلفون: De Pestel, F., Moens, P., Hakim, H., De Vleeschouwer, H., Reynders, K., Colpaert, T., Colson, P., Coppens, P., Boonen, S., Bolognesi, D., Tack, M.

المصدر: ISPSD '03. 2003 IEEE 15th International Symposium on Power Semiconductor Devices & ICs, 2003; 2003, p182-185, 4p

المؤلفون: De Pestel, F., Coppens, P., De Vleeschouwer, H., Colson, P., Boonen, S., Colpaert, T., Moens, P., Bolognesi, D., Coudenys, G., Tack, M.

المصدر: ESSDERC '03. 33rd Conference on European Solid-State Device Research, 2003; 2003, p191-194, 4p