المؤلفون: Li, Haiying

مصطلحات موضوعية: Electronic packaging Materials, Epoxy resins, Electric conductivity

وصف الملف: 5239186 bytes; application/pdf

الإتاحة: http://hdl.handle.net/1853/5342Test

المؤلفون: Li, Haiying

مصطلحات موضوعية: Graft copolymers, Polymers, Polymeric composites, Textile fibers, Synthetic

وصف الملف: 234 bytes; text/html

الإتاحة: http://hdl.handle.net/1853/8594Test

المؤلفون: Wong, C. P., Li, Haiying

المساهمون: School of Materials Science and Engineering, College of Engineering

مصطلحات موضوعية: Coefficient of thermal expansion (CTE), Differential scanning calorimetry, Dynamic mechanical analysis (DMA), Electrically conductive adhesive (ECA), FT-IR, Glass transmission temperature (Tg), Isotropically conductive adhesive (ICA), Nuclear magnetic resonance (NMR), Thermo-gravimetry analysis (TGA)

وصف الملف: 458555 bytes; application/pdf

العلاقة: IEEE Transactions on Advanced Packaging, Vol. 27, no. 1, February 2004, 165-172; http://hdl.handle.net/1853/11286Test

الإتاحة: http://hdl.handle.net/1853/11286Test

المؤلفون: Wong, C. P., Zhang, Zhuqing, Li, Haiying

المساهمون: School of Materials Science and Engineering, College of Engineering

مصطلحات موضوعية: Assembly, Material properties, Reworkable, Reliability, Underfill

وصف الملف: 1240038 bytes; application/pdf

العلاقة: IEEE Transactions on Advanced Packaging, Vol. 27, no. 3, August 2004, 525-532; http://hdl.handle.net/1853/11435Test

الإتاحة: http://hdl.handle.net/1853/11435Test

المؤلفون: Wong, C. P., Li, Haiying, Jacob, Karl I.

المساهمون: School of Materials Science and Engineering, College of Engineering

مصطلحات موضوعية: Carbon fiber, Encapsulants, Flip-chip packages, Glass transition temperature, Silica, TCE, Underfill materials

وصف الملف: 1128595 bytes; application/pdf

العلاقة: IEEE Transactions on Advanced Packaging, Vol. 26, No. 1, February 2003, 25-32; http://hdl.handle.net/1853/11099Test

الإتاحة: http://hdl.handle.net/1853/11099Test

المؤلفون: Wong, C. P., Li, Haiying, Johnson, Ashanti

المساهمون: School of Materials Science and Engineering, College of Engineering

مصطلحات موضوعية: Epoxy, Electronic packaging, Eutectic Sn-Pb, Flipchip, Fluxing agent, Lead-free, No-flow, Solder, Underfill

وصف الملف: 709680 bytes; application/pdf

العلاقة: IEEE Transactions on Components and Packaging Technologies, Vol. 26, no. 2, June 2003, 466-472; http://hdl.handle.net/1853/11430Test

الإتاحة: http://hdl.handle.net/1853/11430Test

المؤلفون: Wong, C. P., Wang, Lejun, Li, Haiying

المساهمون: School of Materials Science and Engineering, College of Engineering

مصطلحات موضوعية: Compress-flow underfill, Flip-chip devices, Flux underfill, No-flow underfill, Reworkable underfill

وصف الملف: 164576 bytes; application/pdf

العلاقة: IEEE transactions on electronics packaging manufacturing, Vol. 24, no. 2, April 2001, 115-122; http://hdl.handle.net/1853/11100Test

الإتاحة: http://hdl.handle.net/1853/11100Test