دورية أكاديمية
Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide
| العنوان: | Direct-on-barrier copper electroplating on ruthenium from the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide |
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| المؤلفون: | D'Urzo, Lucia, Schaltin, Stijn, Shkurankov, Andrey, Plank, Harald, Kothleitner, Gerald, Gspan, Christian, Binnemans, Koen, Fransaer, Jan |
| بيانات النشر: | Chapman and Hall VAN GODEWIJCKSTRAAT 30, 3311 GZ DORDRECHT, NETHERLANDS |
| سنة النشر: | 2012 |
| المجموعة: | KU Leuven: Lirias |
| مصطلحات موضوعية: | chemical-vapor-deposition, atomic layer deposition, thin-film, electrodeposition, copper, nucleation, ruthenium, ionic liquids, iodine, metals |
| الوصف: | The "direct-on-barrier" electroplating of copper on ruthenium from a 1 mol dm(-3) solution of CuCl in the ionic liquid 1-ethyl-3-methylimidazolium dicyanamide, [C(2)mim][N(CN)(2)], is reported. Continuous layers of copper with a preferential Cu(111) orientation were obtained from this electrolyte. The copper coatings were investigated by top view scanning electron microscopy (SEM), X-ray diffraction (XRD), and focused ion beam transmission electron microscopy (FIB-TEM). The nucleation density was both theoretically and experimentally evaluated by the Scharifker-Hills model and transmission electron microscopy, respectively. The direct plating of copper on resistive substrates for advanced interconnects and package is a promising new application of ionic liquids. ; status: published |
| نوع الوثيقة: | article in journal/newspaper |
| اللغة: | English |
| تدمد: | 0957-4522 1573-482X |
| العلاقة: | Journal of Materials Science. Materials in Electronics vol:23 issue:4 pages:945-951; https://lirias.kuleuven.be/handle/123456789/350026Test; https://lirias.kuleuven.be/bitstream/123456789/350026/3//pub05847.pdfTest |
| DOI: | 10.1007/s10854-011-0525-4 |
| الإتاحة: | https://doi.org/10.1007/s10854-011-0525-4Test https://lirias.kuleuven.be/handle/123456789/350026Test https://lirias.kuleuven.be/bitstream/123456789/350026/3//pub05847.pdfTest |
| رقم الانضمام: | edsbas.5E4EFF7F |
| قاعدة البيانات: | BASE |
| تدمد: | 09574522 1573482X |
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| DOI: | 10.1007/s10854-011-0525-4 |