دورية أكاديمية

Highly transparent low capacitance plasma enhanced atomic layer deposition Al2O3-HfO2 tunnel junction engineering

التفاصيل البيبلوغرافية
العنوان: Highly transparent low capacitance plasma enhanced atomic layer deposition Al2O3-HfO2 tunnel junction engineering
المؤلفون: El Hajjam, Khalil, Baboux, Nicolas, Calmon, Francis, Souifi, Abdelkader, Poncelet, Olivier, Francis, Laurent, Ecoffey, Serge, Drouin, Dominique
المساهمون: UCL - SST/ICTM/ELEN - Pôle en ingénierie électrique
المصدر: Journal of Vacuum Science and Technology. Part A. Vacuum, Surfaces and Films, Vol. 32, no.1, p. 01A132 - 01A132-6 (01/2014)
بيانات النشر: American Institute of Physics
سنة النشر: 2014
المجموعة: DIAL@UCL (Université catholique de Louvain)
الوصف: The development of metallic single electron transistor (SET) depends on the downscaling and the electrical properties of its tunnel junctions. These tunnel junctions should insure high tunnel current levels, low thermionic current, and low capacitance. The authors use atomic layer deposition to fabricate Al2O3 and HfO2 thin layers. Tunnel barrier engineering allows the achievement of low capacitance Al2O3 and HfO2 tunnel junctions using optimized annealing and plasma exposure conditions. Different stacks were designed and fabricated to increase the transparency of the tunnel junction while minimizing thermionic current. This tunnel junction is meant to be integrated in SET to enhance its electrical properties (e.g., operating temperature, I ON/I OFF ratio).
نوع الوثيقة: article in journal/newspaper
اللغة: Ndonga
تدمد: 0734-2101
العلاقة: boreal:140671; http://hdl.handle.net/2078.1/140671Test; urn:ISSN:0734-2101
DOI: 10.1116/1.4853075
الإتاحة: https://doi.org/10.1116/1.4853075Test
http://hdl.handle.net/2078.1/140671Test
حقوق: info:eu-repo/semantics/restrictedAccess
رقم الانضمام: edsbas.84AFEA8E
قاعدة البيانات: BASE
الوصف
تدمد:07342101
DOI:10.1116/1.4853075