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1دورية أكاديمية
المؤلفون: Jeong Il Lee, Jong-Min Kim, Myeong Jin Jung, Yi Hyeon Ha
المصدر: MATERIALS TRANSACTIONS. 2023, 64(11):2673
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2دورية أكاديمية
المؤلفون: Byung-Seung Yim, Jong-Min Kim, Min Jeong Ha, Sangil Kim, Won Chul Cho
المصدر: MATERIALS TRANSACTIONS. 2023, 64(4):939
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3
المؤلفون: Min Jeong Ha, Sangil Kim, Won Chul Cho, Jong-Min Kim, Byung-Seung Yim
المصدر: MATERIALS TRANSACTIONS. 64:939-942
مصطلحات موضوعية: Mechanics of Materials, Mechanical Engineering, General Materials Science, Condensed Matter Physics
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::baaa4a3e2b3906e07d97c72603942cffTest
https://doi.org/10.2320/matertrans.mt-m2022200Test -
4دورية أكاديمية
المؤلفون: Myeong Jin Jung, Yi Hyeon Ha, Jong-Min Kim, Jeong Il Lee
المصدر: Materials Transactions; 2023, Vol. 64 Issue 11, p2673-2676, 4p
مصطلحات موضوعية: SOLDER & soldering, SOLDER joints, DISPERSION strengthening, MICROHARDNESS testing, INTERMETALLIC compounds
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5دورية أكاديمية
المؤلفون: Byung-Seung Yim, Hee Jun Youn, Jong-Min Kim, Sangil Kim
المصدر: MATERIALS TRANSACTIONS. 2021, 62(12):1802
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6دورية أكاديمية
المؤلفون: Byung-Seung Yim, Hee Jun Youn, Jeong Il Lee, Jong-Min Kim
المصدر: MATERIALS TRANSACTIONS. 2020, 61(12):2442
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7
المؤلفون: Jong-Min Kim, Byung-Seung Yim, Sangil Kim, Hee Jun Youn
المصدر: MATERIALS TRANSACTIONS. 62:1802-1805
مصطلحات موضوعية: Materials science, Mechanics of Materials, Mechanical Engineering, visual_art, Soldering, visual_art.visual_art_medium, General Materials Science, Epoxy, Composite material, Condensed Matter Physics, Mechanism (sociology)
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::56ecaff52c86690025ee393072b2bde3Test
https://doi.org/10.2320/matertrans.mt-m2021144Test -
8دورية أكاديمية
المؤلفون: Byung-Seung Yim, Jae Woo Lee, Jong-Min Kim
المصدر: MATERIALS TRANSACTIONS. 2020, 61(3):557
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9دورية أكاديمية
المؤلفون: Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim
المصدر: MATERIALS TRANSACTIONS. 2018, 59(9):1528
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10
المؤلفون: Jeong Il Lee, Hee Jun Youn, Byung-Seung Yim, Jong-Min Kim
المصدر: MATERIALS TRANSACTIONS. 61:2442-2445
مصطلحات موضوعية: Interconnection, Filler (packaging), Materials science, Mechanical Engineering, Alloy, Low melting point, engineering.material, Condensed Matter Physics, Mechanism (engineering), Mechanics of Materials, Polymer composites, engineering, Particle, General Materials Science, Composite material, Reinforcement
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::984dea657691122ffd4d96349dde952cTest
https://doi.org/10.2320/matertrans.mt-m2020265Test