التفاصيل البيبلوغرافية
| العنوان: |
Low-Stress Permalloy for Magnetic MEMS Switches. |
| المؤلفون: |
Yonghua Zhang1 zyh@sjtu.edu.cn, Guifu Ding1, Hong Wang1, Shi Fu1, Bingchu Cai1 |
| المصدر: |
IEEE Transactions on Magnetics. Jan2006, Vol. 42 Issue 1, p51-55. 5p. |
| مصطلحات موضوعية: |
RESIDUAL stresses, MAGNETIC films, MAGNETIC materials, MICROELECTROMECHANICAL systems, ELECTROPLATING, METAL coating |
| مستخلص: |
The residual stress in the electroplated magnetic films is an important factor that limits the functionality of many micromagnetic devices. We have investigated the stress in electroplated Ni-Fe alloy for MEMS as a function of bath concentration, utilizing the wafer-bending method. Our investigation demonstrated that a low-concentration plating solution decreases the residual stress in the electrode-posits, and the stress is further decreased by increasing the saccharin additive content. We obtained the low-stress Permalloy Ni81 Fe19 in our experimental conditions. We fabricated a bistable electromagnetic RF MEMS switch with deformation-free cantilever beam using the electroplated Permalloy. [ABSTRACT FROM AUTHOR] |
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| قاعدة البيانات: |
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