مؤتمر
Reliability analysis of bumping schemes under chip package interaction
| العنوان: | Reliability analysis of bumping schemes under chip package interaction |
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| المؤلفون: | Kappaganthu, Sri Ramakanth, Karmarkar, Aditya, Xu, Xiaopeng, El Sayed, Karim, Avci, Ibrahim, Chawla, Vikas, Mishra, Bikash, Kucherov, Andrey, Zhou, Weixing, Johnson, Mark, Balasingam, Pratheep |
| المصدر: | IEEE International Interconnect Technology Conference |
| بيانات النشر: | IEEE |
| سنة النشر: | 2014 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/iitc.2014.6831850 |
| الإتاحة: | https://doi.org/10.1109/iitc.2014.6831850Test http://xplorestaging.ieee.org/ielx7/6826038/6831822/06831850.pdf?arnumber=6831850Test |
| رقم الانضمام: | edsbas.591F3825 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/iitc.2014.6831850 |
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