التفاصيل البيبلوغرافية
| العنوان: |
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers. |
| المؤلفون: |
Papatryfonos, Konstantinos, Selviah, David R., Maman, Avi, Hasharoni, Kobi, Brimont, Antoine, Zanzi, Andrea, Kraft, Jochen, Sidorov, Victor, Seifried, Marc, Baumgartner, Yannick, Horst, Folkert, Offrein, Bert Jan, Lawniczuk, Katarzyna, Broeke, Ronald G., Terzenidis, Nikos, Mourgias-Alexandris, George, Tang, Mingchu, Seeds, Alwyn J., Liu, Huiyun, Sanchis, Pablo |
| المصدر: |
Applied Sciences (2076-3417); Jul2021, Vol. 11 Issue 13, p6098, 24p |
| مصطلحات موضوعية: |
SEMICONDUCTOR quantum dots, SERVER farms (Computer network management), OPTICAL interconnects, SEMICONDUCTOR wafer bonding, DISTRIBUTED feedback lasers, FLIP chip technology, QUANTUM dots, PHOTONIC crystal fibers |
| مستخلص: |
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges. [ABSTRACT FROM AUTHOR] |
|
Copyright of Applied Sciences (2076-3417) is the property of MDPI and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) |
| قاعدة البيانات: |
Complementary Index |
Full Text Finder