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1دورية أكاديمية
المصدر: Applied Food Research, Vol 1, Iss 1, Pp 100011- (2021)
مصطلحات موضوعية: chickpea flour, film, active packaging, UV-protective, copper removal, Food processing and manufacture, TP368-456
وصف الملف: electronic resource
العلاقة: http://www.sciencedirect.com/science/article/pii/S2772502221000111Test; https://doaj.org/toc/2772-5022Test
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المصدر: Applied Food Research, Vol 1, Iss 1, Pp 100011-(2021)
مصطلحات موضوعية: Materials science, Active packaging, Langmuir adsorption model, chemistry.chemical_element, TP368-456, film, Copper, Food processing and manufacture, chickpea flour, Food packaging, symbols.namesake, Adsorption, chemistry, Chemical engineering, active packaging, copper removal, Monolayer, symbols, Solubility, Water content, UV-protective
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4ec7f5caf1d06b54082f44773be7e04Test
http://www.sciencedirect.com/science/article/pii/S2772502221000111Test -
3دورية
المؤلفون: Aguirre, A, Mendez, X., Borneo, R
المصدر: Applied Food Research; June 2021, Vol. 1 Issue: 1