Inkjet Fabrication of Copper Patterns for Flexible Electronics: Using Paper with Active Precoatings
| العنوان: | Inkjet Fabrication of Copper Patterns for Flexible Electronics: Using Paper with Active Precoatings |
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| المؤلفون: | Öhlund, Thomas, Schuppert, Anna, Hummelgård, Magnus, Bäckström, Joakim, Nilsson, Hans-Erik, Olin, Håkan |
| المصدر: | ACS Applied Materials and Interfaces. 7(33):18273-18282 |
| مصطلحات موضوعية: | intense pulsed light sintering, flash light sintering, printed flexible electronics, inkjet printing, paper coatings, copper patterns, IPL sintering, IPL processing, paper electronics, CuO reduction, inkjet fabrication |
| الوصف: | Low-cost solution-processing of highly conductive films is important for the expanding market of printed electronics. For roll-to-roll manufacturing, suitable flexible substrates and compatible postprocessing are essential. Here, custom-developed coated papers are demonstrated to facilitate the inkjet fabrication of high performance copper patterns. The patterns are fabricated in ambient conditions using water-based CuO dispersion and intense pulsed light (IPL) processing. Papers using a porous CaCO3 precoating, combined with an acidic mesoporous absorption coating, improve the effectiveness and reliability of the IPL process. The processing is realizable within 5 ms, using a single pulse of light. A resistivity of 3.1 ± 0.12 μΩ·cm is achieved with 400 μm wide conductors, corresponding to more than 50% of the conductivity of bulk copper. This is higher than previously reported results for IPL-processed copper. |
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| الوصول الحر: | https://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-23419Test http://pubs.acs.org/doi/abs/10.1021/acsami.5b03061Test |
| قاعدة البيانات: | SwePub |
| تدمد: | 19448244 19448252 |
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| DOI: | 10.1021/acsami.5b03061 |