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1مؤتمر
المؤلفون: Penny, C., Gates, S., Peethala, B., Lee, J., Priyadarshini, D., Nguyen, S., McLaughlin, P., Liniger, E., Hu, C.-K., Clevenger, L., Hook, T., Shobha, H., Kerber, P., Seshadri, I., Chen, J., Edelstein, D., Quon, R., Bonilla, G., Paruchuri, V., Huang, E.
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2017.7968970Test
http://xplorestaging.ieee.org/ielx7/7961614/7968934/07968970.pdf?arnumber=7968970Test -
2مؤتمر
المؤلفون: Nogami, T., Patlolla, R., Kelly, J., Briggs, B., Huang, H., Demarest, J., Li, J., Hengstebeck, R., Zhang, X., Lian, G., Peethala, B., Bhosale, P., Maniscalco, J., Shobha, H., Nguyen, S., McLaughlin, P., Standaert, T., Canaperi, D., Edelstein, D., Paruchuri, V.
المصدر: 2017 IEEE International Interconnect Technology Conference (IITC)
الإتاحة: https://doi.org/10.1109/iitc-amc.2017.7968961Test
http://xplorestaging.ieee.org/ielx7/7961614/7968934/07968961.pdf?arnumber=7968961Test