مؤتمر
Development of heat sink integrated transfer molded power modules with Thermal Conductive Insulating Sheet
| العنوان: | Development of heat sink integrated transfer molded power modules with Thermal Conductive Insulating Sheet |
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| المؤلفون: | Yamamoto, Kei, Rokubuichi, Hodaka, Nishimura, Takashi, Hiramatsu, Seiki, Nakajima, Dai, Kitai, Kiyofumi, Goto, Yoichi |
| المصدر: | 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) |
| بيانات النشر: | IEEE |
| سنة النشر: | 2016 |
| نوع الوثيقة: | conference object |
| اللغة: | unknown |
| DOI: | 10.1109/ispsd.2016.7520880 |
| الإتاحة: | https://doi.org/10.1109/ispsd.2016.7520880Test http://xplorestaging.ieee.org/ielx7/7509008/7520753/07520880.pdf?arnumber=7520880Test |
| رقم الانضمام: | edsbas.A6452B85 |
| قاعدة البيانات: | BASE |
| DOI: | 10.1109/ispsd.2016.7520880 |
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