-
1مؤتمر
المؤلفون: Ki-Jun Sung, Kwang-Seong Choi, Byeong-Ok Lim, Hyun-Cheol Bae, Sun-Woo Choo, Jong-Tae Moon, Yong Hwan Kwon, Eun Soo Nam, Yong-Sung Eom
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
الإتاحة: https://doi.org/10.1109/icept.2010.5582448Test
http://xplorestaging.ieee.org/ielx5/5570125/5582326/05582448.pdf?arnumber=5582448Test -
2مؤتمر
المؤلفون: Choi, Kwang-Seong, Sun-Woo Choo, Jong-Jin Lee, Ki-Jun Sung, Hyun-Chel Bae, Byeong-Ok Lim, Jong-Tae Moon, Eom, Yong-Sung
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
الإتاحة: https://doi.org/10.1109/icept.2010.5582689Test
http://xplorestaging.ieee.org/ielx5/5570125/5582326/05582689.pdf?arnumber=5582689Test -
3
المؤلفون: Byeong-Ok Lim, Ki-Jun Sung, Sun-Woo Choo, Hyun-Chel Bae, Yong-Sung Eom, Kwang-Seong Choi, Jong-Jin Lee, Jong-Tae Moon
المصدر: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
مصطلحات موضوعية: Materials science, Reliability (semiconductor), business.industry, Soldering, Optoelectronics, Fine pitch, Bumping, Composite material, business, Flip chip, Design for manufacturability
الوصول الحر: https://explore.openaire.eu/search/publication?articleId=doi_________::0f550fddb7fb1fb9df99d49ffb3d1992Test
https://doi.org/10.1109/icept.2010.5582689Test