Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology.

التفاصيل البيبلوغرافية
العنوان: Ultra-low-temperature process modules for back-wafer-contacted silicon-on-glass RF/microwave technology.
المؤلفون: Nanver, L.K., Gonda, V., Civale, Y., Scholtes, T.L.M., La Spina, L., Schellevis, H., Lorito, G., Sarubbi, F., Popadic, M., Buisman, K., Milosavljevic, S., Goudena, E.J.G.
المصدر: 2008 9th International Conference on Solid-State & Integrated-Circuit Technology; 2008, p1184-1187, 4p
قاعدة البيانات: Complementary Index
الوصف
ردمك:9781424421855
DOI:10.1109/ICSICT.2008.4734758