مؤتمر
New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging.
| العنوان: | New Nano-Thermal Interface Material for Heat Removal in Electronics Packaging. |
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| المؤلفون: | Liu, J., Olorunyomi, M.O., Xiuzhen Lu, Wen Xuan Wang, Aronsson, T., Shangguan, D. |
| المصدر: | 2006 1st Electronic Systemintegration Technology Conference; 2006, p1-6, 6p |
| قاعدة البيانات: | Complementary Index |
| ردمك: | 9781424405527 |
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| DOI: | 10.1109/ESTC.2006.279970 |