Patent
Method of manufacturing flexible substrate structure and flexible flat device
| العنوان: | Method of manufacturing flexible substrate structure and flexible flat device |
|---|---|
| Patent Number: | 8,773,625 |
| تاريخ النشر: | July 08, 2014 |
| Appl. No: | 13/479252 |
| Application Filed: | May 23, 2012 |
| مستخلص: | A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure. |
| Inventors: | Li, Wen-Yuan (Hsin-Chu, TW); Chiu, Pin-Hsiang (Hsin-Chu, TW); Hsueh, Yu-Chieh (Hsin-Chu, TW); Chen, Li-Yin (Hsin-Chu, TW); Wei, Min-Chih (Hsin-Chu, TW); Lin, Shiuan-Iou (Hsin-Chu, TW) |
| Assignees: | AU Optronics Corp. (Science-Based Industrial Park, Hsin-Chu, TW) |
| Claim: | 1. A method of manufacturing a flexible substrate structure, comprising: providing a first loading substrate having a center area and a peripheral area disposed on at least one side of the center area; forming a first adhesive layer on the center area of the first loading substrate; forming a second adhesive layer on the peripheral area of the first loading substrate; adhering a first flexible substrate to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein an adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer; cutting the flexible substrate structure comprising cutting the second adhesive layer along a direction parallel to the first loading substrate and the first flexible substrate from a gap between the first loading substrate and the first flexible substrate; and separating the first flexible substrate from the first loading substrate, the first adhesive layer and the second adhesive layer. |
| Claim: | 2. The method according to claim 1 , wherein the adhesive force between the first flexible substrate and the second adhesive layer is substantially more than 0.15 N/inch. |
| Claim: | 3. The method according to claim 1 , wherein an area ratio of the peripheral area to the center area of the first loading substrate is substantially more than 0.5. |
| Claim: | 4. A method of manufacturing a flexible flat device, comprising: providing a first loading substrate having a center area and a peripheral area disposed on at least one side of the center area; forming a first adhesive layer on the center area of the first loading substrate; forming a second adhesive layer on the peripheral area of the first loading substrate; adhering a first flexible substrate to the first loading substrate by the first adhesive layer and the second adhesive layer, wherein an adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer; providing a second loading substrate having a center area and a peripheral area disposed on at least one side of the center area; forming a third adhesive layer on the center area of the second loading substrate; forming a fourth adhesive layer on the peripheral area of the second loading substrate; adhering a second flexible substrate to the second loading substrate by the third adhesive layer and the fourth adhesive layer, wherein an adhesive force between the second flexible substrate and the fourth adhesive layer is stronger than that between the second flexible substrate and the third adhesive layer; adhering the first flexible substrate to the second flexible substrate by a fifth adhesive layer to form a flexible substrate structure, wherein an adhesive force between the first flexible substrate and the fifth adhesive layer is stronger than that between the first flexible substrate and the second adhesive layer, and an adhesive force between the second flexible substrate and the fifth adhesive layer is stronger than that between the second flexible substrate and the fourth adhesive layer; cutting the flexible substrate structure comprising: cutting the second adhesive layer along a direction parallel to the first loading substrate and the first flexible substrate from a gap between the first loading substrate and the first flexible substrate, separating the first flexible substrate from the flexible substrate structure; and cutting the fourth adhesive layer along a direction parallel to the first loading substrate and the second flexible substrate from a gap between the second loading substrate and the second flexible substrate, separating the second flexible substrate from the flexible substrate structure. |
| Claim: | 5. The method according to claim 4 , wherein the adhesive force between the first flexible substrate and the second adhesive layer is substantially more than 0.15 N/inch, the adhesive force between the second flexible substrate and the fourth adhesive layer is substantially more than 0.15 N/inch, the adhesive force between the fifth adhesive layer and the first flexible substrate is substantially more than 0.5 N/inch, and the adhesive force between the fifth adhesive layer and the second flexible substrate is substantially more than 0.5 N/inch. |
| Claim: | 6. The method according to claim 4 , wherein the step of cutting the flexible substrate structure includes cutting the first loading substrate, the first flexible substrate, the second flexible substrate and the second loading substrate along a fringe of the center area of the first loading substrate to separate the first flexible substrate from the first loading substrate, and to separate the second flexible substrate from the second loading substrate. |
| Claim: | 7. The method according to claim 4 , wherein the step of cutting the flexible substrate structure includes: cutting the second adhesive layer along a gap between the first loading substrate and the first flexible substrate to separate the first flexible substrate from the first loading substrate; and cutting the fourth adhesive layer along a gap between the second loading substrate and the second flexible substrate to separate the second flexible substrate from the second loading substrate. |
| Claim: | 8. The method according to claim 4 , wherein before adhering the first flexible substrate and the second flexible substrate, the method further comprises: forming a light modulating layer between the first flexible substrate and the second flexible substrate. |
| Claim: | 9. The method according to claim 8 , wherein the light modulating layer includes a liquid crystal layer. |
| Claim: | 10. The method according to claim 4 , wherein an area ratio of the peripheral area to the center area of the first loading substrate is substantially more than 0.5. |
| Current U.S. Class: | 349/122 |
| Patent References Cited: | 6667250 December 2003 Sasaoka 6802926 October 2004 Mizutani 7825002 November 2010 Takayama 2006/0254704 November 2006 Seo et al. 2008/0099134 May 2008 Tadakuma 2009/0207370 August 2009 Tsuchiya et al. 2010/0167437 July 2010 Yamazaki et al. 2010/0203296 August 2010 Tsai 2011/0228492 September 2011 Haq et al. 2011/0310344 December 2011 Yang et al. 2012/0164408 June 2012 Hwu 102176435 September 2011 201010247 January 2010 201030693 August 2010 201115249 May 2011 201234947 August 2012 |
| Assistant Examiner: | Lau, Edmond |
| Primary Examiner: | Won, Bumsuk |
| Attorney, Agent or Firm: | Hsu, Winston Margo, Scott |
| رقم الانضمام: | edspgr.08773625 |
| قاعدة البيانات: | USPTO Patent Grants |
| الوصف غير متاح. |