التفاصيل البيبلوغرافية
| العنوان: |
SEMICONDUCTOR CHIP PACKAGE |
| Document Number: |
20100283141 |
| تاريخ النشر: |
November 11, 2010 |
| Appl. No: |
12/463431 |
| Application Filed: |
May 11, 2009 |
| مستخلص: |
A semiconductor chip package includes a chip; first and second connection pads arranged in a matrix and disposed about the chip, and the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body. |
| Inventors: |
Chang, Chun-Wei (Taipei County, TW); Hsieh, Tung-Hsien (Changhua County, TW); Liu, Chia-Hui (Taichung County, TW) |
| Claim: |
1. A semiconductor chip package, comprising: a chip; a plurality of inner connection pads disposed about a periphery of the chip; a plurality of outer connection pads disposed between the plurality of inner connection pads and a periphery of the semiconductor chip package, wherein one of the outer connection pads has an oval shape when viewed from a bottom of the semiconductor chip package; a plurality of bonding pads provided on an active surface of the chip and being electrically connected with corresponding said inner and outer connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the inner and outer connection pads such that a lower portion of each of the inner and outer connection pads extends outward from a bottom of the package body. |
| Claim: |
2. The semiconductor chip package according to claim 1 wherein one of the inner connection pads has a circular shape when viewed from the bottom of the semiconductor chip package. |
| Claim: |
3. The semiconductor chip package according to claim 1 wherein one of the inner connection pads has a square shape when viewed from the bottom of the semiconductor chip package. |
| Claim: |
4. The semiconductor chip package according to claim 1 wherein the semiconductor chip package is a quad flat non-lead (QFN) package. |
| Claim: |
5. The semiconductor chip package according to claim 1 further comprising a die pad, and wherein the chip is attached to the die pad. |
| Claim: |
6. The semiconductor chip package according to claim 1 wherein the inner and outer connection pads are arranged in a matrix that has one single pitch. |
| Claim: |
7. The semiconductor chip package according to claim 1 wherein the plurality of inner connection pads has a first space between two of the inner connection pads, and the plurality of outer connection pads has a second space between two of the outer connection pads, and wherein the second space is larger than the first space. |
| Claim: |
8. The semiconductor chip package according to claim 1 wherein each said lower portion of the outer connection pads has a major axis and a minor axis, and the major axis is substantially directed in a radial direction relative to a center of the chip. |
| Claim: |
9. The semiconductor chip package according to claim 1 wherein each said lower portion of the outer connection pads has a major axis and a minor axis, and the major axis is substantially perpendicular to an outside edge of the chip. |
| Claim: |
10. The semiconductor chip package according to claim 1 wherein each said lower portion of the outer connection pads has a major axis and a minor axis, and the major axis is directed in a diagonal direction that is in parallel with a diagonal line of the semiconductor chip package. |
| Claim: |
11. A quad flat non-lead (QFN) package, comprising: a chip; a plurality of first and second connection pads arranged in a matrix and disposed about the chip, wherein the first and second connection pads have different bottom surface shapes when viewed from a bottom of the QFN package; a plurality of bonding pads provided on an active surface of the chip and being electrically connected with corresponding said connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the connection pads such that a lower portion of each of the connection pads extends outward from a bottom of the package body. |
| Claim: |
12. The QFN package according to claim 11 wherein the matrix of the first and second connection pads is radially symmetrical about a center of the chip. |
| Claim: |
13. The QFN package according to claim 11 wherein the matrix of the first and second connection pads has one single pitch. |
| Claim: |
14. The QFN package according to claim 11 further comprising a die pad, and wherein the chip is attached to the die pad. |
| Claim: |
15. The QFN package according to claim 11 wherein the first connection pads are inner connection pads and the second connection pads are outer connection pads, and wherein the bottom surface area of one of the outer connection pads is smaller than or equal to that of one of the inner connection pads. |
| Claim: |
16. The QFN package according to claim 15 wherein one of the bottom surface area of the outer connection pads is oval shaped and has a major axis and a minor axis, and wherein the major axis is substantially directed in a radial direction relative to a center of the chip. |
| Claim: |
17. The QFN package according to claim 15 wherein one of the bottom surface area of the outer connection pads is oval shaped and has a major axis and a minor axis, and wherein the major axis is substantially perpendicular to an outside edge of the chip. |
| Claim: |
18. The QFN package according to claim 15 wherein one of the bottom surface area of the outer connection pads is oval shaped and has a major axis and a minor axis, and wherein the major axis is substantially directed in a diagonal direction that is in parallel with a diagonal line of the QFN package. |
| Claim: |
19. The QFN package according to claim 11 wherein one of the bottom surface area of the outer connection pads is rectangular shaped and has a long side and a short side. |
| Claim: |
20. A semiconductor chip package, comprising: a chip; a plurality of inner connection pads disposed about a periphery of the chip; a plurality of outer connection pads disposed between the plurality of inner connection pads and the periphery of the chip, wherein one of the outer connection pads has a rectangular shape with a long side and a short side when viewed from a bottom of the semiconductor chip package; a plurality of bonding pads provided on an active surface of the chip and being electrically connected with corresponding said inner and outer connection pads through bonding wires; and a package body encapsulating the chip, the bonding wires and an upper portion of each of the inner and outer connection pads such that a lower portion of each of the inner and outer connection pads extends outward from a bottom of the package body. |
| Current U.S. Class: |
257/690 |
| Current International Class: |
01 |
| رقم الانضمام: |
edspap.20100283141 |
| قاعدة البيانات: |
USPTO Patent Applications |
