التفاصيل البيبلوغرافية
| العنوان: |
POTTING FOR ELECTRONIC COMPONENTS |
| Document Number: |
20110272191 |
| تاريخ النشر: |
November 10, 2011 |
| Appl. No: |
13/102029 |
| Application Filed: |
May 05, 2011 |
| مستخلص: |
A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning. |
| Inventors: |
LI, Haiying (Elk Grove, CA, US); Harrison, William Lee (El Dorado Hills, CA, US) |
| Assignees: |
TYCO ELECTRONICS SERVICES GMBH (Schaffhausen, CH) |
| Claim: |
1. A potting material for an electronic component, the potting material formed by curing a mixture, the mixture comprising: an epoxy component having a long hydrocarbon-chain epoxy and an epoxy terminated butadiene polymer; an organic amine hardener; a viscosity-controlling agent; and a silica. |
| Claim: |
2. The potting material of claim 1, wherein the epoxy terminated butadiene polymer forms above about 10% by weight of the mixture. |
| Claim: |
3. The potting material of claim 1, wherein the long-chain epoxy forms above about 10% by weight of the mixture. |
| Claim: |
4. The potting material of claim 1, wherein the silica is a spherically shaped silica. |
| Claim: |
5. The potting material of claim 1, wherein all particles of the silica have a maximum dimension between about 2 microns and about 15 microns. |
| Claim: |
6. The potting material of claim 1, wherein the long-chain epoxy is selected from the group consisting of 9-octa-decenoic acid, 12-(2-oxiranylmethoxy)-1,2,3-propanetriyl ester, polytetramethylene glycol digylcidylether, and combinations thereof. |
| Claim: |
7. The potting material of claim 1, wherein the epoxy component further comprises one or more of a bisphenol-A type epoxy resin and a bisphenol-F type epoxy resin. |
| Claim: |
8. The potting material of claim 1, wherein the epoxy component comprises a resin selected from the group consisting of cycloaliphatic epoxy resin, bisphenol-A type epoxy resin, bisphenol-F type epoxy resin, epoxy novolac resin, biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene-phenol type epoxy resins, and combinations thereof. |
| Claim: |
9. The potting material of claim 1, wherein the epoxy component comprises three linear aliphatic epoxides. |
| Claim: |
10. The potting material of claim 1, wherein the epoxy component comprises 2,2-bis(4-hydroxyphenyl) propane-epichlorohydrin copolymer (R1=H) and 2,2′-{3,3′,5,5′-tetramethyl{2,2′ biphenyl}(-4,4′-diyl)bis(oxymethylene)}bisoxirane (R1=CH3). |
| Claim: |
11. The potting material of claim 1, wherein the epoxy component comprises co-polymers or oligomers having molecular weights between about 1300 and about 2600. |
| Claim: |
12. The potting material of claim 1, wherein the epoxy component comprises long linear branched or un-branched chain epoxy terminated hydrocarbon compounds having molecular weights greater than about 700. |
| Claim: |
13. The potting material of claim 1, wherein the epoxy component comprises one or more of 9-octa-decenoic acid, 12-(2-oxiranylmethoxy)-1,2,3-propanetriyl ester, and polytetramethylene glycol diglycidylether. |
| Claim: |
14. The potting material of claim 1, further comprising a ferrite. |
| Claim: |
15. The potting material of claim 1, wherein the organic amine hardener is selected from the group consisting of an alkyl-substituted amine, an aryl-substituted amine, an alkyl-substituted amine salt, an inorganic derivative of ammonia or an amine, a chloramine, a modified polyethylenepolyamine adduct, a tetraethylenepentamine, a diethylenetriamine, a triethylenetetramine, a polyaminoamide, and combinations thereof. |
| Claim: |
16. The potting material of claim 1, further comprising a silane coupling agent, the coupling agent selected from the group consisting of an epoxy type silane coupling agent, an amine type silane coupling agent, a mercapto type silane coupling agent, and combinations thereof. |
| Claim: |
17. The potting material of claim 1, further comprising a non-ionic surfactant, the non-ionic surfactant selected from the group consisting of silicones, polyoxyethylene/polyoxypropylene block copolymers, ethylene diamine based polyoxyethylene/polyoxypropylene block copolymers, polyol-based polyoxyalkylenes, fatty alcohol-based polyoxyalkylenes, fatty alcohol polyoxyalkylene alkyl ethers, and combinations thereof. |
| Claim: |
18. The potting material claim 1, wherein the potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component and wherein the potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning. |
| Claim: |
19. An electronic component, comprising: a potting material, the potting material formed by curing a mixture, the mixture comprising: an epoxy component; an organic amine hardener; a viscosity-controlling agent; and a silica; an inorganic ferrite having an inorganic ferrite coefficient of thermal expansion; an organic substrate having an organic substrate coefficient of thermal expansion; wherein the potting material has a coefficient of thermal expansion between the inorganic ferrite coefficient of thermal expansion and the organic substrate coefficient of thermal expansion. |
| Claim: |
20. A process of positioning ferrites in an electronic component, the process comprising: applying a mixture to an organic substrate and curing the mixture to form a potting material, the mixture comprising: an epoxy component; an organic amine hardener; a viscosity-controlling agent; a silica; applying the ferrites, the ferrites being applied by one or more of applying the ferrites to the organic substrate as a part of the mixture and applying the ferrites to the potting material; wherein the potting material has a thermal coefficient of expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. |
| Current U.S. Class: |
174/521 |
| Current International Class: |
01; 05; 05; 08 |
| رقم الانضمام: |
edspap.20110272191 |
| قاعدة البيانات: |
USPTO Patent Applications |
