المؤلفون: Tan, V. B. C.¹ mpetanbc@nus.edu.sg, Tong, M. X.¹, Kian Meng Lim¹, Chwee Teck Lim¹

المصدر: IEEE Transactions on Components & Packaging Technologies. Sep2005, Vol. 28 Issue 3, p555-560. 6p.

مصطلحات موضوعية: *ELECTRONIC packaging, *FINITE element method, *INTEGRATED circuits, *MICROELECTRONICS, BALL grid array technology, ELECTRONICS

المؤلفون: Seldes RM (AUTHOR), Grisso JA (AUTHOR), Pavell JR (AUTHOR), Berlin JA (AUTHOR), Tan V (AUTHOR), Bowman B (AUTHOR), Kinman JL (AUTHOR), Fitzgerald RH Jr. (AUTHOR)

المصدر: American Journal of Public Health. Feb1999, Vol. 89 Issue 2, p238-241. 4p.

URL: 1521588

المؤلفون: Plouchart, J.-O.¹ plouchar@us.ibm.com, Zamdnier, N.¹ noahz@us.ibm.com, Kim, J.¹ jonghae@us.ibm.com, Sheroriy, M.¹ sherony@us.ibm.com, Tan, V.¹ yuetan@us.ibm.com, Ray, A.¹ raya@us.ibm.com, Tatbi, M.¹ talbi@us.ibm.com, Wagner, L. F.¹ wagnerl@us.ibm.com, Wu, K.¹ kunwu@us.ibm.com, Lustig, N. E.¹ lustig@us.ibm.com, Narasimha, S.¹ snaras@us.ibm.com, O'Neii, P.¹ poneil@us.ibm.com, Phan, N.² nphan@us.ibm.com, Rohn, M.² mrohn@us.ibm.com, Strom, J.² jstrom@ua.ibm.com, Friend, D. M.² dmfriend@us.ibm.com, Kosonocky, S. V.³ stevekos@us.ibm.com, Knebel, D. R.³ knebeld@us.ibm.com, Kim, S.³ suhwan@us.ibm.com, Jenkins, K. A.³ jenkinsk@us.ibm.com

المصدر: IBM Journal of Research & Development. Sep/Nov2003, Vol. 47 Issue 5/6, p611-629. 19p.

مصطلحات موضوعية: *INTEGRATED circuits, SILICON-on-insulator technology, COMPLEMENTARY metal oxide semiconductors, TRANSISTORS, SEMICONDUCTORS, ELECTRONIC circuits