دورية أكاديمية

Conductor Architecture, Filamentary Interconnections and Current Distribution in...

التفاصيل البيبلوغرافية
العنوان: Conductor Architecture, Filamentary Interconnections and Current Distribution in...
المؤلفون: Bugoslavsky, Y., Perkins, G., Buscemi, P., Caplin, A.D., Leghissa, Martino, Oomen, Marijn P.
المصدر: IEEE Transactions on Applied Superconductivity. Mar2001 Part 3 of 3, Vol. 11 Issue 1, p2788. 4p. 2 Black and White Photographs, 3 Diagrams, 3 Graphs.
مصطلحات موضوعية: SUPERCONDUCTORS, ELECTRIC currents, ELECTRONICS
مستخلص: Examines the conductor architecture, filamentary interconnections and current distribution in BiSCCO-2223-based tape superconductors. Tape homogeneity; Filament microstructure; Filament arrangement.
قاعدة البيانات: Business Source Index
الوصف
تدمد:10518223
DOI:10.1109/77.919642