Ion implantation into Si covered by HfO2 or SiO2 film

التفاصيل البيبلوغرافية
العنوان: Ion implantation into Si covered by HfO2 or SiO2 film
المؤلفون: Shi, H, Yu, M, Huang, R, Zhang, X, Wang, YY
المساهمون: Shi, H (reprint author), Peking Univ, Inst Microelect, Beijing 100871, Peoples R China., Peking Univ, Inst Microelect, Beijing 100871, Peoples R China.
المصدر: SCI ; EI
سنة النشر: 2004
المجموعة: Peking University Institutional Repository (PKU IR) / 北京大学机构知识库
مصطلحات موضوعية: HfO2, ion implantation, molecular dynamics, Monte Carlo, range profiles, simulation
الوصف: Ion implantations into HfO2 and SiO2 are simulated comparatively by using a molecular dynamics simulator LEACS [1]. With precise physical models and high efficiency algorithms implemented in LEACS, the simulated results accurately agree with the SIMS data. Based on the verification of the LEACS simulator, Oxide Thickness Modulation Effect (OTME for short) has been quantitatively investigated by simulating implantations in HfO2/Si and SiO2/Si multiplayer structures, respectively. A much more drastic OTME for implantation in HfO2/Si is observed from simulation. It is found that if HfO2 replaces SiO2 as the gate dielectric, the shift of the range profiles in Si substrate is in the order of several 10%s of the total junction depth, which will have a significant impact on MOS device performance in IC process of next decade. ; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000226292200039&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701Test ; Materials Science, Multidisciplinary ; Physics, Condensed Matter ; EI ; CPCI-S(ISTP) ; 0
نوع الوثيقة: conference object
اللغة: English
تدمد: 0277-786X
العلاقة: FIFTH INTERNATIONAL CONFERENCE ON THIN FILM PHYSICS AND APPLICATIONS.5774(176-179).; 1061687; http://hdl.handle.net/20.500.11897/293804Test; WOS:000226292200039
DOI: 10.1117/12.607558
الإتاحة: https://doi.org/20.500.11897/293804Test
https://doi.org/10.1117/12.607558Test
https://hdl.handle.net/20.500.11897/293804Test
رقم الانضمام: edsbas.2CF3FBC8
قاعدة البيانات: BASE
الوصف
تدمد:0277786X
DOI:10.1117/12.607558