رسالة جامعية
Coupling Design for Packaging III-V laser with SOI Photonic Chips using Semiconductor Micro-Mirrors
| العنوان: | Coupling Design for Packaging III-V laser with SOI Photonic Chips using Semiconductor Micro-Mirrors |
|---|---|
| المؤلفون: | Parnika Gupta |
| سنة النشر: | 2019 |
| المجموعة: | National Taiwan University of Science and Technology Repository (NTUSTR) / 台灣科技大學 |
| مصطلحات موضوعية: | Coupling Efficiency, III-V laser source, Photonic Chips, Wave Propagation, Ray Propagation |
| الوصف: | 國立臺灣科技大學電子工程系 ; 學位：碩士 ; 指導教授：李三良 ; The integration of active and passive devices has been instrumental in achieving hybrid silicon laser as well as optical interconnects. In this thesis, the integration of active III-V laser and Silicon-On-Insulator Photonic Integrated Circuits through micro-mirror has been proposed. The micro-mirror is required to attain the phase matching with the grating coupler on the PIC surface. The light emitted by the III-V laser is input into the concave micro-mirror with alignment conditions such that the light reflected from the micro-mirror can be coupled into the grating coupler. The initial part of the thesis shows the simulation for coupling light using the FDTD wave propagation as well as Ray-tracing models. The FDTD modeling shows the highest coupling efficiency of 64% using an apodized grating coupler. The apodized grating thickness has been designed as 520 nm with an etch depth of 220 nm using the polysilicon overlay technique. The output waveguide thickness has been designed to be the standard 220 nm thickness for single-mode transmission. The Ray Tracing Model has been used to study the free space light propagation and reflection characteristics of the concave mirror. The laser source position has been designed to be 150 μm away from the concave mirror center and 167 μm away from the center of the concave mirror, near the edge of the 200 μm diameter mirror. The coupled power in this ray-tracing model has been computed to be 40.859% when the detector is at a distance of 100μm from the mirror edge. The thesis also presents the fabrication method of the semiconductor concave micro-mirror which includes the combination of V-groove fabrication and BCB coating followed by gold deposition on the top surface. The V-groove fabrication is achieved through the traditional anisotropic etching method followed by BCB spin coating in the V-grooves. Different BCB spin-coating parameters have been investigated for three different chips to determine the best mirror surface followed by gold ... |
| نوع الوثيقة: | thesis |
| وصف الملف: | 169 bytes; text/html |
| اللغة: | English |
| العلاقة: | http://ir.lib.ntust.edu.tw/handle/987654321/77705Test; http://ir.lib.ntust.edu.tw/bitstream/987654321/77705/1/index.htmlTest |
| الإتاحة: | http://ir.lib.ntust.edu.tw/handle/987654321/77705Test http://ir.lib.ntust.edu.tw/bitstream/987654321/77705/1/index.htmlTest |
| رقم الانضمام: | edsbas.C9774BAD |
| قاعدة البيانات: | BASE |
| الوصف غير متاح. |