كتاب
Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications
| العنوان: | Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications |
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| المؤلفون: | Michael Shearn, Xiankai Sun, M. David Henry, Amnon Yariv, Axel Scherer |
| المصدر: | https://www.intechopen.com/books/3644Test. |
| بيانات النشر: | IntechOpen |
| سنة النشر: | 2010 |
| المجموعة: | IntechOpen (E-Books) |
| مصطلحات موضوعية: | Semiconductor Technologies |
| نوع الوثيقة: | book part |
| اللغة: | English |
| ردمك: | 978-953-307-080-3 953-307-080-3 |
| العلاقة: | https://mts.intechopen.com/articles/show/title/advanced-plasma-processing-etching-deposition-and-wafer-bonding-techniques-for-semiconductor-applicaTest |
| DOI: | 10.5772/8564 |
| الإتاحة: | https://doi.org/10.5772/8564Test https://mts.intechopen.com/articles/show/title/advanced-plasma-processing-etching-deposition-and-wafer-bonding-techniques-for-semiconductor-applicaTest |
| حقوق: | https://creativecommons.org/licenses/by-nc-sa/3.0Test/ |
| رقم الانضمام: | edsbas.7FD255BB |
| قاعدة البيانات: | BASE |
| ردمك: | 9789533070803 9533070803 |
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| DOI: | 10.5772/8564 |