Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC

التفاصيل البيبلوغرافية
العنوان: Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC
المؤلفون: Marconi, S., Barbero, M., Fougeron, D., Godiot, S., Menouni, M., Pangaud, P., Rozanov, A., Breugnon, P., Bomben, M., Calderini, G., Crescioli, F., Dortz, O. Le, Marchiori, G., Dzahini, Daniel, Rarbi, F., Gaglione, R., Krüger, H., Daas, M., Dieter, Y., Hemperek, T., Hügging, F., Moustakas, K., Pohl, D., Rymaszewski, P., Standke, M., Vogt, M., Wang, T., Wermes, N., Karagounis, M., Stiller, A., Marzocca, C., Marzocca, G., de Robertis, G., Loddo, F., Licciulli, F., Andreazza, A., Liberali, V., Stabile, A., Frontini, L., Bagatin, M., Bisello, D., Gerardin, S., Mattiazzo, S., Paccagnella, A., Vogrig, D., Bonaldo, S., Bacchetta, N., Gaioni, L., de Canio, F., Manghisoni, M., Re, V., Riceputi, E., Traversi, G., Ratti, L., Vacchi, C., Androsov, K., Beccherle, R., Magazzu, G., Minuti, M., Morsani, F., Palla, F., Poulios, S., Bilei, G., Menichelli, M., Placidi, P., Dellacasa, G., Demaria, N., Mazza, G., Monteil, E., Pacher, L., Paterno, A., Rivetti, A., da Rocha Rolo, M., Gajanana, D., Gromov, V., van Eijk, B., Kluit, R., Vitkovskiy, A., Benka, T., Havranek, M., Janoska, Z., Marcisovsky, M., Neue, G., Tomasek, L., Kafka, V., Vrba, V., Lopez-Morillo, E., Palomo, F., Munoz, F., Vila, I., Jimenez, E., Abbaneo, D., Christiansen, J., Orfanelli, S., Jara Casas, L., Conti, E., Bell, S., Prydderch, M., Thomas, S., Christian, D., Deptuch, G., Fahim, F., Hoff, J., Lipton, R., Liu, T., Zimmerman, T., Miryala, S., Garcia-Sciveres, M., Gnani, D., Krieger, A., Papadopoulou, K., Heim, T., Carney, R., Nachman, B., Renteira, C., Wallangen, V., Hoeferkamp, M., Seidel, S.
المساهمون: Centre de Physique des Particules de Marseille (CPPM), Aix Marseille Université (AMU)-Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Centre National de la Recherche Scientifique (CNRS), Laboratoire de Physique Subatomique et de Cosmologie (LPSC), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes 2016-2019 (UGA 2016-2019 ), Laboratoire d'Annecy de Physique des Particules (LAPP), Institut National de Physique Nucléaire et de Physique des Particules du CNRS (IN2P3)-Université Savoie Mont Blanc (USMB Université de Savoie Université de Chambéry )-Centre National de la Recherche Scientifique (CNRS)
المصدر: 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference Proceedings (NSS/MIC)
2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)
https://hal.science/hal-02530634Test
2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), Nov 2018, Sydney, France. pp.8824486, ⟨10.1109/NSSMIC.2018.8824486⟩
بيانات النشر: HAL CCSD
IEEE
سنة النشر: 2018
المجموعة: HAL-IN2P3 (Institut national de physique nucléaire et de physique des particules)
مصطلحات موضوعية: CMOS image sensors, mixed analogue-digital integrated circuits, nuclear electronics, position sensitive particle detectors, readout electronics, silicon radiation detectors, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [PHYS.PHYS.PHYS-INS-DET]Physics [physics]/Physics [physics]/Instrumentation and Detectors [physics.ins-det]
جغرافية الموضوع: Sydney, France
الوصف: International audience ; The RD53A large scale pixel demonstrator chip has been developed in 65 nm CMOS technology by the RD53 collaboration, in order to face the unprecedented design requirements of the pixel 2 phase upgrades of the CMS and ATLAS experiments at CERN. This prototype chip is designed to demonstrate that a set of challenging specifications can be met, such as: high granularity (small pixels of 50×50 or 25× 100 µm2) and large pixel chip size (~2x2 cm2), high hit rate (3 GHz/cm2), high readout speed, very high radiation levels (500 Mrad - 1 Grad) and operation with serial powering. Furthermore, coping with the long latency of the trigger signal (~12.5 µs), used to select only events of interest in order to achieve sustainable output data rates, requires increased buffering resources in the limited pixel area. The RD53A chip has been fabricated in an engineer run. It integrates a matrix of 400×192 pixels and features various design variations in the analog and digital pixel matrix for testing purposes. This paper presents an overview of the chip architecture and of the methodologies used for efficient design of large complex mixed signal chips for harsh radiation environments. Experimental results obtained from the characterization of the RD53A chip are reported to demonstrate that design objectives have been achieved. Moreover, design improvements and new features being developed in the RD53B framework for final ATLAS and CMS production chips are discussed
نوع الوثيقة: conference object
اللغة: English
العلاقة: hal-02530634; https://hal.science/hal-02530634Test
DOI: 10.1109/NSSMIC.2018.8824486
الإتاحة: https://doi.org/10.1109/NSSMIC.2018.8824486Test
https://hal.science/hal-02530634Test
رقم الانضمام: edsbas.8DA2D339
قاعدة البيانات: BASE