المؤلفون: Lin, Chung-Ching, Wang, Jiang, Luo, Kun, Lin, Kevin, Li, Linjie, Wang, Lijuan, Liu, Zicheng

المصدر: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR)

الإتاحة: https://doi.org/10.1109/cvpr52729.2023.00986Test
http://xplorestagingTest.ieee.org/ielx7/10203037/10203050/10204386.pdf?arnumber=10204386

المؤلفون: Xu, Haoqing, Zhan, Guohui, Li, Shixin, Wu, Jiahao, Luo, Kun, Liu, Yu, He, Chao, Wu, Zhenhua

المصدر: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

الإتاحة: https://doi.org/10.23919/sispad57422.2023.10319623Test
http://xplorestagingTest.ieee.org/ielx7/10319472/10319477/10319623.pdf?arnumber=10319623

المؤلفون: Zhan, Guohui, Luo, Kun, Jia, Ruoran, Yang, Christopher, Wu, Zhenhua

المساهمون: Ministry of Science and Technology, National Natural Science Foundation of China

المصدر: 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

الإتاحة: https://doi.org/10.23919/sispad57422.2023.10319590Test
http://xplorestagingTest.ieee.org/ielx7/10319472/10319477/10319590.pdf?arnumber=10319590

المؤلفون: Luo, Kun, Wen, Wanli, Xia, Wenchao

المساهمون: National Natural Science Foundation of China, China Postdoctoral Science Foundation, Natural Science Foundation of Chongqing, Southeast University

المصدر: 2023 International Conference on Wireless Communications and Signal Processing (WCSP)

الإتاحة: https://doi.org/10.1109/wcsp58612.2023.10404488Test
http://xplorestagingTest.ieee.org/ielx7/10404087/10404080/10404488.pdf?arnumber=10404488

المؤلفون: Luo, Kun

المصدر: 2023 2nd International Conference on 3D Immersion, Interaction and Multi-sensory Experiences (ICDIIME)

الإتاحة: https://doi.org/10.1109/icdiime59043.2023.00071Test
http://xplorestagingTest.ieee.org/ielx7/10227857/10229520/10229788.pdf?arnumber=10229788

المؤلفون: Cao, Lei, Liu, Yang, Wu, Zhenhua, Zhang, Qingzhu, Yao, Jiaxin, Luo, Yanna, Xu, Haoqing, Zhao, Peng, Luo, Kun, Wu, Yongqin, Bu, Weihai, Yin, Huaxiang

المساهمون: Youth Innovation Promotion Association, Chinese Academy of Sciences, National Natural Science Foundation of China

المصدر: 2022 China Semiconductor Technology International Conference (CSTIC)

الإتاحة: https://doi.org/10.1109/cstic55103.2022.9856910Test
http://xplorestagingTest.ieee.org/ielx7/9856647/9856709/09856910.pdf?arnumber=9856910

المؤلفون: Raza, Muhammad Usama, Zhang, Zhongqing, Liu, Tong, Shoukat, Muhammad Usman, Niaz, Ashfaq, Luo, Kun

المصدر: 2021 7th International Conference on Computer and Communications (ICCC)

الإتاحة: https://doi.org/10.1109/iccc54389.2021.9674696Test
http://xplorestagingTest.ieee.org/ielx7/9674217/9674209/09674696.pdf?arnumber=9674696

المؤلفون: Luo, Kun, Sun, Hui-Jie, Wu, Yu-Yao

المساهمون: Research and Development, National Natural Science Foundation of China

المصدر: 2021 China Automation Congress (CAC)

الإتاحة: https://doi.org/10.1109/cac53003.2021.9727952Test
http://xplorestagingTest.ieee.org/ielx7/9727224/9727236/09727952.pdf?arnumber=9727952

المؤلفون: Luo, Kun

المصدر: 2021 IEEE International Conference on Advances in Electrical Engineering and Computer Applications (AEECA)

الإتاحة: https://doi.org/10.1109/aeeca52519.2021.9574383Test
http://xplorestagingTest.ieee.org/ielx7/9574040/9574122/09574383.pdf?arnumber=9574383

المؤلفون: Luo, Kun, Xiong, Gang, Wang, Yuxiao, Hu, Bin, Liu, Sheng, Chen, Shichao

المساهمون: National Key Research and Development Program of China, National Natural Science Foundation of China

المصدر: 2021 IEEE 1st International Conference on Digital Twins and Parallel Intelligence (DTPI)

الإتاحة: https://doi.org/10.1109/dtpi52967.2021.9540130Test
http://xplorestagingTest.ieee.org/ielx7/9540064/9540047/09540130.pdf?arnumber=9540130